Die folgenden Begriffe wurden einbezogen:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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2024,
Ankarson P, Bergqvist B
2024 International Symposium on Electromagnetic Compatibility – EMC Europe, Brugge, Belgium. IEEE: S. 590-594; ISBN 9798350343045
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2024,
Bellosono L, D’ Agostino S, Colella M, Contessa GM, Polichetti A, Liberti M, Apollonio F
2024 International Symposium on Electromagnetic Compatibility – EMC Europe, Brugge, Belgium. IEEE: S. 579-583; ISBN 9798350343045
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2024,
Stroka S, Haussmann N, Kasolis F, Clemens M
2024 International Symposium on Electromagnetic Compatibility – EMC Europe, Brugge, Belgium. IEEE: S. 762-767; ISBN 9798350343045
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2024,
Zuo Z, Wang Q, Zheng J, Jeong H, Kumar A, Chen J
2024 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), Phoenix, AZ, USA. IEEE: S. 369-373; ISBN 9798350360400
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2024,
Huang X, Scoles S, Nguyen P, Chen J, Wisniewski J, Wan Y, Jiang GJ
2024 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), Phoenix, AZ, USA. IEEE: S. 365-368; ISBN 9798350360400
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2024,
Lee C, Rhee J, Lee S, Kwon H, Park Y, Shin Y, Ahn S
2024 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), Phoenix, AZ, USA. IEEE: S. 604-607; ISBN 9798350360400
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2024,
Ardeshirpour Y, Guag J, Silberberg JL, Seidman SJ
2024 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), Phoenix, AZ, USA. IEEE: S. 359-364; ISBN 9798350360400
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2024,
Cvetković M, Poljak D, Dodig H
2024 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), Phoenix, AZ, USA. IEEE: S. 167-172; ISBN 9798350360400
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2024,
Campi T, Cruciani S, Maradei F, Feliziani M
2024 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), Phoenix, AZ, USA. IEEE: S. 446-449; ISBN 9798350360400
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2024,
Clemente GC, Morais GI, Fonseca FHS, Concentino GL, Fraidenraich G
IEEE Electromagn Compat Mag 13 (2): 40-53