Die folgenden Begriffe wurden einbezogen:
"elektromagnetische Verträglichkeit", EMC, EMV, "electromagnetic compatibility", 電磁両立性
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2020,
Yang X, Zheng J, Chen J
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: 266-269; ISBN 978-1-7281-7431-0
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2024,
Yao A, Pei Y, He J, Wang J, Yang P
IEEE Trans Electromagn Compat 66 (2): 405-416
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2017,
Yao L, Shen T, Kang N, Huang J, Liu D, Zhang F, Sun H
IEEE Trans Electromagn Compat 59 (2): 352 - 359
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2024,
Yao M, Pedersen GF, Zhang S
IEEE Trans Electromagn Compat [im Druck]
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2023,
Yao M, Zhekov SS, Xu B, Li K, Zhang S
IEEE Trans Electromagn Compat 65 (5): 1292-1299
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2017,
Yavolovskaya E, Gabriadze G, Chiqovani G, Jobava R
2017 XXIInd International Seminar/Workshop on Direct and Inverse Problems of Electromagnetic and Acoustic Wave Theory (DIPED), Dnipro. IEEE, Dnipro, Ukraine: 183-186; ISBN 978-1-5090-0605-2
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2017,
Yavolovskaya E, Willmann B, Gabriadze G, Chiqovani G, Sukhiashvili Z, Iosava S, Svanidze L, Jobava R
2017 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Angers. IEEE, Angers, France; ISBN 978-1-5386-0689-6
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2016,
Yavolovskaya E, Chiqovani G, Gabriadze G, Iosava S, Svanidze L, Willmann B, Jobava R
2016 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Wroclaw, Poland. IEEE: 491-196; ISBN 978-1-5090-1417-0
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2014,
Yngve Hamnerius, Tomas Nilsson
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 364-368; ISBN 978-1-4799-3226-9
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2012,
Yoshino Y, Igo S, Katsuragi M, Taki M
International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, 2012. IEEE: 13225679; ISBN 978-1-4673-0717-8