Die folgenden Begriffe wurden einbezogen:
"elektromagnetische Verträglichkeit", EMC, EMV, "electromagnetic compatibility", 電磁両立性
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2019,
Geyikoglu MD, Koc Polat H, Cavusoglu B
2019 Fifth International Electromagnetic Compatibility Conference (EMC Turkiye), Kocaeli, Turkey. IEEE: 1-5; ISBN 978-1-7281-1836-9
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2020,
Ghnimi S, Gharsallah A
J Electr Syst 16 (1): 134-145
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2016,
Ghnimi S, Hajri JBR, Harrathi F, Gharsallah A
2016 17th International Conference on Sciences and Techniques of Automatic Control and Computer Engineering (STA), Sousse, Tunisia. IEEE; ISBN 978-1-5090-3408-6
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2020,
Giaccone L, Cirimele V, Canova A
IEEE Trans Electromagn Compat 62 (1): 83-92
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2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: 1-6; ISBN 978-1-7281-5580-7
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2022,
Gifuni A, Adil M, Grassini G, Buono A, Nunziata F, Micheli D, Migliaccio M
IEEE Trans Electromagn Compat 64 (4): 951-962
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2021,
Gifuni A, Grassini G, Buono A, Festa D, Flintoft ID, Gargiulo S, Nunziata F, Migliaccio M
IEEE Trans Electromagn Compat 63 (2): 427-434
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2005,
Giliberti C, Bedini A, Palomba R, D'Emilia E, Magli CV, Giuliani L
IEEE 6th International Symposium on Electromagnetic Compatibility and Electromagnetic Ecology, 2005, St. Petersburg, Russia. IEEE: 208-212; ISBN 978-0-7803-9374-5
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2000,
Gilligan P, Somerville S, Ennis JT
Br J Radiol 73 (873): 994-998
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2023,
Giurgiuman A, Gliga M, Bojita A, Andreica S, Munteanu C, Topa V, Constantinescu C, Pacurar C
Technologies 11 (6): 159
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2019,
Gomez-Tames J, Rashed E, Hirata A, Tarnaud T, Tanghe E, Van de Steene T, Martens L, Joseph W
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: 162-165; ISBN 978-1-7281-1639-6
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2019,
Gomez-Tames J, Tarnaud T, Miwa K, Hirata A, Van de Steene T, Martens L, Tanghe E, Joseph W
IEEE Trans Electromagn Compat 61 (6): 1944 - 1952
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2018,
Gomez-Tames J, Laakso I, Haba Y, Hirata A, Poljak D, Yamazaki K
IEEE Trans Electromagn Compat 60 (3): 589 - 597
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2017,
Gong Y, Capstick M, Kuehn S, Wilson P, Ladbury J, Koepke G, McCormick DL, Melnick RL, Kuster N
IEEE Trans Electromagn Compat 59 (6): 1798-1808
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2007,
Gonzalez MC, Peratta A, Poljak D
IEEE Trans Electromagn Compat 49 (1): 153-162
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2011,
Gosselin MC, Vermeeren G, Kuhn S, Kellerman V, Benkler S, Uusitupa TMI, Joseph W, Gati A, Wiart J, Meyer FJC, Martens L, Nojima T, Hikage T, Balzano Q, Christ A, Kuster N
IEEE Trans Electromagn Compat 53 (4): 909-922
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2009,
Gosselin MC, Christ A, Kühn S, Kuster N
IEEE Trans Electromagn Compat 51 (2): 227-235
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2020,
Gravina A, Moglie F, Bastianelli L, Mariani Primiani V
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: 1-6; ISBN 978-1-7281-5580-7
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2022,
Grazian F, Shi W, Soeiro TB, Dong J, Bauer P
2022 Wireless Power Week (WPW), Bordeaux, France. IEEE: 54-59; ISBN 978-1-6654-8446-6
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2019,
Grazian F, Shi W, Dong J, van Duijsen P, Soeiro TB, Bauer P
2019 AEIT International Conference of Electrical and Electronic Technologies for Automotive (AEIT AUTOMOTIVE), Torino, Italy. IEEE: 1-5; ISBN 978-1-7281-3278-5
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IEEE 6th International Symposium on Electromagnetic Compatibility and Electromagnetic Ecology, 2005, St. Petersburg, Russia. IEEE: 9-14; ISBN 978-0-7803-9374-5
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2007,
Gruber S, Meier M, Moser M, Ryf S, Burgherr R, Fitzpatrick M, Riederer M, Siegenthaler A, Reusser D
Bundesamt für Gesundheit (BAG),
1-36
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2023,
Gryz K, Karpowicz J, Zradziński P
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland. IEEE: 1-5; ISBN 9798350324013
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2022,
Gryz K, Karpowicz J, Zradziński P
Sensors 22 (5): 1719
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2019,
Gryz K, Karpowicz J
2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Barcelona, Spain. IEEE: 1030-1033; ISBN 978-1-7281-0595-6
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2022,
Guo R, Xia M, Zheng J, Chen J, Shrivastava D
2022 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Beijing, China. IEEE: 210-212; ISBN 978-1-6654-1672-6
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2020,
Gusarov AV, Rostovtsev VL, Safonov LV, Shurygin SN
Zh Nevrol Psikhiatr Im S S Korsakova 120 (2): 76-80
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2014,
Gutierrez O, Navarro MA, de Adana FS, Escobar A, Moncada ME, Muñoz CM
J Electromagn Anal 6 (7): 141-155
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2023,
Gutiérrez-Martínez J, Toledo-Peral CL, Vega-Martínez G, Mercado-Gutiérrez JA
2023 Global Medical Engineering Physics Exchanges/Pacific Health Care Engineering (GMEPE/PAHCE), Songdo, Korea, Republic of. IEEE: 1-6; ISBN 9798350304015
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2010,
Hadjem A, Conil E, Gati A, Wong MF, Wiart J
IEEE Trans Electromagn Compat 52 (4): 812-819
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2021,
Hakuta Y, Watanabe T, Takenaka T, Ito T, Hirata A
IEEE Trans Electromagn Compat 63 (1): 313-318
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CMAJ 154 (3): 373-375
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2022,
Hammen L, Pichon L, Le Bihan Y, Bensetti M, Fleury G
2022 International Symposium on Electromagnetic Compatibility – EMC Europe, Gothenburg, Sweden. IEEE: 114-119; ISBN 978-1-6654-0789-2
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2004,
Hanada E, Hoshino Y, Kudou T
Fieschi M, Coiera E, Li YCJ (Hrsg.): MEDINFO 2004. Studies in Health Technology and Informatics, Band 107; IOS Press, Amsterdam; 1426-1429; ISBN 978-1-58603-444-3
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1999,
Hansen VW, Bitz AK, Streckert JR
IEEE Trans Electromagn Compat 41 (4): 487-493
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IEEE Trans Electromagn Compat 58 (1): 40-46
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2014,
Haridim M, Levin B, Revich S, Chulski S, Sauleau R, Zemach R
IEEE Electromagn Compat Mag 3 (4): 43-48
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2016,
Hariri A, El Hariri M, El Sayyed A, Mohammed OA
2016 IEEE Vehicle Power and Propulsion Conference (VPPC), Hangzhou, China. IEEE; ISBN 978-1-5090-3529-8
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IEEE Trans Electromagn Compat 32 (1): 67-69
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2022 IEEE 9th International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications (MAPE), Chengdu, China. IEEE: 319-322; ISBN 978-1-6654-2776-0
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2018,
He W, Gao Z, Zhang W
Zhongguo Yi Liao Qi Xie Za Zhi 42 (5): 372-374
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2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: 166-169; ISBN 978-1-7281-1639-6
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2019,
He Y, Leung PSW, Chow Y, Diao Y
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: 750-753; ISBN 978-1-7281-1639-6
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2018,
He Y, Sun W, Leung PSW, Siu TYM, Ng KT
2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore. IEEE: 936-939; ISBN 978-1-5090-3955-5
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2016,
He Y, Diao Y, Sun W, Leung SW, Siu YM
2016 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Shenzhen, China. IEEE: 639-641; ISBN 978-1-4673-9494-9
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2002,
Hedjiedj A, Goeury C, Nadi M
J Med Eng Technol 26 (5): 223-227
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2014,
Higashiyama J, Tarusawa Y
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 650-653; ISBN 978-4-88552-287-1
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2013,
Higashiyama J, Tarusawa Y
International Symposium on Electromagnetic Compatibility, Brugge, 2013. IEEE: 93-98; ISBN 978-1-4673-4980-2
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Health Estate 65 (1): 49-54
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2017,
Hikage T, Yamagishi M, Shindo K, Nojima T
2017 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Seoul, Korea (South). IEEE; ISBN 978-1-5386-3913-9