Die folgenden Begriffe wurden einbezogen:
透過性、透磁率, Durchlässigkeit, Permeabilität, permeability
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2023,
Bajtos M, Radil R, Janoušek L, Bajtos M, Dang N
2023 24th International Conference on Computational Problems of Electrical Engineering (CPEE), Grybów, Poland. IEEE: 1-4; ISBN 9798350330359
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2023,
Li H, Cui K, Wang Y, Chen G
2023 Light Conference, Changchun, China. IEEE: 1-5; ISBN 9798350327175
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2023,
Zhang B, Yamauchi Y, Galigekere VP, Onar OC, Mohammad M
2023 IEEE Transportation Electrification Conference & Expo (ITEC), Detroit, MI, USA. IEEE: 1-6; ISBN 9798350397437
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2023,
Wang K, Guo L, Zhang Q, Ning H, Wang S, Gong Y
2023 24th International Vacuum Electronics Conference (IVEC), Chengdu, China. IEEE: 1-2; ISBN 978-1-6654-7322-4
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2022,
Medellín-Serafín AE, Vera-Hernández A, Leija-Salas L, Gutiérrez-Velazco MI, Trujillo-Romero CJ, Gutierrez-Martínez J
2022 Global Medical Engineering Physics Exchanges/ Pan American Health Care Exchanges (GMEPE/PAHCE), Panama City, Panama. IEEE: 1-4; ISBN 978-1-6654-8436-7
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2021,
Yue S, Xia W, Yanan L, Mengjun W
2021 13th Global Symposium on Millimeter-Waves & Terahertz (GSMM), Nanjing, China. IEEE: 1-3; ISBN 978-1-6654-3744-8
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2021,
Nehra RK, Raghava NS
2021 International Conference on Industrial Electronics Research and Applications (ICIERA), New Delhi, India. IEEE: 1-5; ISBN 978-1-6654-3543-7
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2021,
Gentilal N, Salvador R, Miranda PC
Brain and Human Body Modeling 2020. Springer, Cham (CH): 37-62; ISBN 978-3-030-45622-1
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2020,
Banou S, Li K, Chowdhury K
IEEE INFOCOM 2020 - IEEE Conference on Computer Communications, Toronto, ON, Canada. IEEE: 1549-1558; ISBN 978-1-7281-6413-7
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2020,
Hough CM, Purschke DN, Huang C, Titova LV, Kovalchuk O, Warkentin BJ, Hegmann FA
2020 45th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz), Buffalo, NY, USA. IEEE: 1-2; ISBN 978-1-7281-6621-6
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2020,
Lu C, Huang X, Rong C, Tao X, Zeng Y, Liu X, Liu M
2020 IEEE 1st China International Youth Conference on Electrical Engineering (CIYCEE), Wuhan, China. IEEE: 1-5; ISBN 978-1-7281-9660-2
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2020,
Savchenko V, Synyavskiy O, Dudnyk A, Nesvidomin A, Ramsh V, Bunko V
2020 IEEE KhPI Week on Advanced Technology (KhPIWeek), Kharkiv, Ukraine. IEEE: 193-198; ISBN 978-0-7381-4241-8
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2020,
Mohammad M, Pries JL, Onar OC, Galigekere VP, Su GL
2020 IEEE Energy Conversion Congress and Exposition (ECCE), Detroit, MI, USA. IEEE: 842-849; ISBN 978-1-7281-5827-3
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2019,
Huang X, Lu C, Tao X, Rong C, Liu M
2019 PhotonIcs & Electromagnetics Research Symposium - Spring (PIERS-Spring), Rome, Italy. IEEE: 4256-4262; ISBN 978-1-7281-3404-8
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2019,
Liu B, Ouyang Z, Li P, Qu Y, Wu T, Wei Z
2019 22nd International Conference on Electrical Machines and Systems (ICEMS), Harbin, China. IEEE: 1-5; ISBN 978-1-7281-3399-7
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2019,
Caramazza L, De Angelis A, Della Valle E, Denzi A, Nardoni M, Paolicelli P, Petralito S, Apollonio F, Liberti M
2019 49th European Microwave Conference (EuMC), Paris, France. IEEE: 220-223; ISBN 978-1-7281-1798-0
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2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: 166-169; ISBN 978-1-7281-1639-6
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2019,
Feng Z, Diao Y, Sun W, He Y, Leung PSW
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: 48-51; ISBN 978-1-7281-1639-6
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2019,
Petrushevskaya A, Rabin A, Kilimnik V
2019 24th Conference of Open Innovations Association (FRUCT), Moscow, Russia. IEEE: 328-334; ISBN 978-1-7281-1429-3
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2018 9th International Conference on Ultrawideband and Ultrashort Impulse Signals (UWBUSIS), Odessa, Ukraine. IEEE: 69-73; ISBN 978-1-5386-2469-2
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2018,
Özgün A, Garipcan B
2018 EMF-Med 1st World Conference on Biomedical Applications of Electromagnetic Fields (EMF-Med), Split, Croatia. IEEE: 1-2; ISBN 978-1-5386-5922-9
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2018,
Sweeney DC, Davalos RV
2018 40th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), Honolulu, HI, USA. IEEE: 5850-5853; ISBN 978-1-5386-3647-3
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2018,
Zharkova LP, Romanchenko IV, Buldakov MA, Priputnev PV, Bolshakov MA, Rostov VV
2018 20th International Symposium on High-Current Electronics (ISHCE), Tomsk, Russia. IEEE: 158-161; ISBN 978-1-5386-6892-4
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2018,
Clemens M, Zang M, Alsayegh B, Schmuelling B
2018 IEEE International Magnetics Conference (INTERMAG), Singapore. IEEE: 1; ISBN 978-1-5386-6426-1
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2018,
Bragin DE, Bragina OA, Hagberg S, Nemoto EM
Heldt T (Hrsg.): Intracranial Pressure & Neuromonitoring XVI. Acta Neurochirurgica Supplement, Band 126; Springer, Cham; 93-95; ISBN 978-3-319-65797-4