Die folgenden Begriffe wurden einbezogen:
Ausplattierung, plating, 平板培養
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2023,
Cerdan B, Flahaut E, Dubuc D, Grenier K
2023 IEEE MTT-S International Microwave Biomedical Conference (IMBioC), Leuven, Belgium. IEEE: 1-3; ISBN 978-1-6654-9218-8
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2023,
Herpers C, Rouse CD
2023 IEEE Wireless Power Technology Conference and Expo (WPTCE), San Diego, CA, USA. IEEE: 1-5; ISBN 9798350337389
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2022,
Yang L, Guo R, Hu W, Zheng J, Kainz W, Chen J
2022 International Conference on Electromagnetics in Advanced Applications (ICEAA), Cape Town, South Africa. IEEE: 311-314; ISBN 978-1-6654-8112-0
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2022,
Moscatiello A, Cerdan B, Gironde C, Furger C, Dubuc D, Grenier K
2022 IEEE/MTT-S International Microwave Symposium - IMS 2022, Denver, CO, USA. IEEE: 794-797; ISBN 978-1-6654-9614-8
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2022,
Lin K, Xu X, Zhao T, Chen SE, Braxtan N, Cook D, Ward D
2022 IEEE Transportation Electrification Conference & Expo (ITEC), Anaheim, CA, USA. IEEE: 606-610; ISBN 978-1-6654-0561-4
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2021,
Adam C, Barth T, Münch M, Seide K, Krautschneider WH
2021 IEEE Biomedical Circuits and Systems Conference (BioCAS), Berlin, Germany. IEEE: 01-06; ISBN 978-1-7281-7205-7
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2021,
Baerov RM, Morega AM, Morega M
2021 12th International Symposium on Advanced Topics in Electrical Engineering (ATEE), Bucharest, Romania. IEEE: 1-6; ISBN 978-1-6654-4807-9
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2021,
Talluri G, Bindi M, Luchetta A, Grasso F, Luchetti L, Paolucci L
2021 IEEE 15th International Conference on Compatibility, Power Electronics and Power Engineering (CPE-POWERENG), Florence, Italy. IEEE: 1-6; ISBN 978-1-7281-8072-4
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2021,
Kroll MW, Hisey DAS, Andrews CJ, Perkins PE, Panescu D
2021 43rd Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC), Mexico. IEEE: 1462-1467; ISBN 978-1-7281-1179-7
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2021,
Mallanna SD, Viswanath K, Rangaiah PKB
2021 Sixth International Conference on Wireless Communications, Signal Processing and Networking (WiSPNET), Chennai, India. IEEE: 6-10; ISBN 978-1-6654-3130-9