Die folgenden Begriffe wurden einbezogen:
Basisgrenzwerte, "basic restrictions", 基本制限
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2021,
Sharma SK, Biswal SP
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IEEE Trans Electromagn Compat 63 (5): 1690-1698
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2021,
Ohtani S, Ushiyama A, Wada K, Suzuki Y, Ishii K, Hattori K
Mutation Research - Fundamental and Molecular Mechanism of Mutagenesis 863-864: 503310
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2021,
Sedehi R, Budgett D, Jiang J, Xia Z, Dai X, Hu P, McCormick M
IEEE Transactions on Power Electronics 36 (2): 1870-1882
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2021,
Hakuta Y, Watanabe T, Takenaka T, Ito T, Hirata A
IEEE Trans Electromagn Compat 63 (1): 313-318
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Energies 13 (14): 3635
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2020,
Liorni I, Bottauscio O, Guilizzoni R, Ankarson P, Bruna J, Fallahi A, Harmon S, Zucca M
Sustainability 12 (11): 4573
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2020,
Überbacher R, Cecil S
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Deutsche Kommission Elektrotechnik Elektronik Informationstechnik in DIN und VDE (DKE),
DIN EN 50413 VDE 0848-1:2020-10
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2020,
Soldati M, Murakami T, Laakso I
Phys Med Biol 65 (21): 215006
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2020,
Christ A, Samaras T, Neufeld E, Kuster N
Bioelectromagnetics 41 (5): 348-359
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2020,
Arduino A, Bottauscio O, Chiampi M, Giaccone L, Liorni I, Kuster N, Zilberti L, Zucca M
IEEE Trans Electromagn Compat 62 (5): 1939-1950
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2020,
Soldati M, Laakso I
Phys Med Biol 65 (1): 015001
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2020,
Liorni I, Lisewski T, Capstick MH, Kuehn S, Neufeld E, Kuster N
IEEE Trans Electromagn Compat 62 (4): 1323-1332
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Deutsche Kommission Elektrotechnik Elektronik Informationstechnik in DIN und VDE (DKE),
DIN EN 50364 VDE 0848-364:2019-05
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International Electrotechnical Commission (IEC),
IEC 62311:2019: 1-71, ISBN 978-2-8-3226763-9
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2019,
Sekiba Y, Yamazaki K
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: S. 83-86; ISBN 978-1-7281-1639-6
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2019,
Shiina T, Yamazaki K
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: S. 744-747; ISBN 978-1-7281-1639-6
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2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Barcelona, Spain. IEEE: S. 1020-1024; ISBN 978-1-7281-0595-6
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2019,
Nagaoka T, Watanabe S
IEEE Access 7: 135909 - 135916
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2019,
Chung YD, Kim DW, Park EY
2019 10th International Conference on Power Electronics and ECCE Asia (ICPE 2019 - ECCE Asia), Busan, Korea (South). IEEE: S. 2240-2245; ISBN 978-1-7281-1612-9
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2019,
Hirata A, Funahashi D, Kodera S
Ann Telecommun 74 (1-2): 17–24
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2019,
Van de Steene T, Tanghe E, Martens L, Joseph W, Kampusch S, Razlighi BD, Kaniusas E, Széles JC
2019 13th International Symposium on Medical Information and Communication Technology (ISMICT), Oslo, Norway. IEEE: S. 1-5; ISBN 978-1-7281-2343-1
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2019,
Shikhantsov S, Thielens A, Vermeeren G, Demeester P, Martens L, Torfs G, Joseph W
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2019,
Chiaramello E, Le Brusquet L, Parazzini M, Fiocchi S, Bonato M, Ravazzani P
Bioelectromagnetics 40 (3): 170-179