Die folgenden Begriffe wurden einbezogen:
Blutströmung, Durchblutung, Blutfluss, "blood perfusion", bloodstream, "blood flow", 血流
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2023,
Al-Sabti SMB, Hamdi MM, Abdulateef AN, Hmad SS, Samir AS, Ali MD
2023 7th International Symposium on Innovative Approaches in Smart Technologies (ISAS), Istanbul, Turkiye. IEEE: 1-6; ISBN 9798350383072
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2023,
Bragina OA, Atochin DA, Trofimov AO, Nemoto E, Bragin DE
Scholkmann F, Lamanna J, Wolf U (Hrsg.): Oxygen Transport to Tissue XLIV. ISOTT 2022. Advances in Experimental Medicine and Biology, Band 1438; Springer, Cham; 9-13; ISBN 978-3-031-42002-3
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2023,
Kulakova K, Vrba J, Dřížďal T
2023 Photonics & Electromagnetics Research Symposium (PIERS), Prague, Czech Republic. IEEE: 1716-1724; ISBN 9798350312850
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2023,
Campi T, Cruciani S, Maradei F, Feliziani M
2023 IEEE Wireless Power Technology Conference and Expo (WPTCE), San Diego, CA, USA. IEEE: 1-4; ISBN 9798350337389
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2022,
Soundar Rajan G, Sakthi Abirami B, Dennis Joshua D, Devi Sowjanya P
2022 International Conference on Intelligent Controller and Computing for Smart Power (ICICCSP), Hyderabad, India. IEEE: 1-5; ISBN 978-1-6654-7259-3
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2021,
Euler L, Juthberg R, Flodin J, Guo L, Ackermann PW, Persson NK
2021 43rd Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC), Mexico. IEEE: 1305-1308; ISBN 978-1-7281-1179-7
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2021,
Gentilal N, Salvador R, Miranda PC
Brain and Human Body Modeling 2020. Springer, Cham (CH): 37-62; ISBN 978-3-030-45622-1
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2020,
Bragina OA, Semyachkina-Glushkovskaya OV, Nemoto EM, Bragin DE
Ryu PD, LaManna JC, Harrison DK, Lee SS (Hrsg.): Oxygen Transport to Tissue XLI. Advances in Experimental Medicine and Biology, Band 1232; Springer, New York; 47-53; ISBN 978-3-030-34459-7
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2019,
Tofighi MR, Attaluri A
2019 IEEE MTT-S International Microwave Symposium (IMS), Boston, MA, USA. IEEE: 228-231; ISBN 978-1-7281-1310-4
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2019,
Kageyama I, Masuda H, Morimatsu Y, Ishitake T, Sakakibara K, Hikage T, Hirata A
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: 766-769; ISBN 978-1-7281-1639-6