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2018,
Kaszuba-Zwoinska J, Nowak B, Guzdek P, Gil K
2018 EMF-Med 1st World Conference on Biomedical Applications of Electromagnetic Fields (EMF-Med), Split, Croatia. IEEE: 1-2; ISBN 978-1-5386-5922-9
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2018,
Shah AA, Alonso F, Vogel D, Wardell K, Coste J, Lemaire JJ, Pison D, Hemm S
2018 40th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), Honolulu, HI, USA. IEEE: 2222-2225; ISBN 978-1-5386-3647-3
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2017,
Salimpour Y, Liu CC, Webber WR, Mills KA, Anderson WS
2017 39th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), Jeju, Korea (South). IEEE: 1110-1113; ISBN 978-1-5090-2810-8
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2017,
Huo X, Zhang G, Wu C, Zhang C
2017 39th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), Jeju, Korea (South). IEEE: 1958-1961; ISBN 978-1-5090-2810-8
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2016,
Sarma AA, Crocker B, Cash SS, Truccolo W
2016 38th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), Orlando, FL, USA. IEEE: 3139-3142; ISBN 978-1-4577-0220-4
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2016,
Gülbağça F, Sal DH, Sayğili S, Sönmez PK, Aydemir I, Özkut M, Öztürk Ş, Gümüşay M, Kaya A, Tuğlu MI
2016 20th National Biomedical Engineering Meeting (BIYOMUT), Izmir. IEEE; ISBN 978-1-5090-5830-3
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2016,
Karaki W, Akyildiz A, Borca Tasciuc DA, De S
Westwood JD, Westwood SW, Felländer-Tsai L, Fidopiastis CM, Liu A, Senger S, Vosburgh KG (Hrsg.): Medicine Meets Virtual Reality 22. Studies in Health Technology and Informatics, Band 220; IOS Press, Amsterdam; 171-174; ISBN 978-1-61499-624-8
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2014,
Kumari S, Raghavan S
International Conference on Information Communication and Embedded Systems (ICICES2014), Chennai. IEEE: 14915635; ISBN 978-1-4799-3835-3
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2014,
Zhou H, Han Y, Zhao M, Tristan LJC, Xu K
2014 International Conference on Multisensor Fusion and Information Integration for Intelligent Systems (MFI), Beijing. IEEE: 14836949 -1-14836949 -9; ISBN 978-1-4799-6732-2
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2014,
Venuturumilli SH, Sundararajan R
2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP), Des Moines, IA, USA. IEEE: 239-242; ISBN 978-1-4799-7525-9