Die folgenden Begriffe wurden einbezogen:
Elektronik, electronics, 電子工学、電子機器
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2024,
Ma ML, Zhao D, Hu ZJ, Wang Y, Liang F, Wang BZ
Electronics 13 (19): 3915
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2024,
Shukla G, Awasthi V, Goswami P, Singh S
2024 IEEE 4th International Conference on Sustainable Energy and Future Electric Transportation (SEFET), Hyderabad, India. IEEE: S. 01-07; ISBN 9798350384000
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2024,
Devi PS, Rekha M, Vemula SN, Pohanekar O, Bhupathi HP, Al-Fatlawy RR, Haranatti JS
2024 IEEE 4th International Conference on Sustainable Energy and Future Electric Transportation (SEFET), Hyderabad, India. IEEE: S. 1-6; ISBN 9798350384000
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2024,
Pappa CK, Kumar DR, Kavitha T, Murugan C
2024 Third International Conference on Electrical, Electronics, Information and Communication Technologies (ICEEICT), Trichirappalli, India. IEEE: S. 1-5; ISBN 9798350369090
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2024,
Ahlawat S, Kanaujia BK, Singh N, Zaidi AM, Rambabu K, Matekovits L
Sci Rep 14: 24827
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2024,
Cordero JJ, Sam AP, Collier ZJ, Johnson MB, Landman MP, Tholpady SS, Yenikomshian HA, Gillenwater TJ, Chu MW
J Surg Res 302: 897-905
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2024,
Picelli A, DI Censo R, Tomasello S, Scaturro D, Letizia Mauro G, Smania N, Filippetti M, Physical Modalities Section of the Italian Society of Physical and Rehabilitation Medicine
Eur J Phys Rehabil Med 60 (6): 989-994
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2024,
Huang X, Scoles S, Nguyen P, Chen J, Wisniewski J, Wan Y, Jiang GJ
2024 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), Phoenix, AZ, USA. IEEE: S. 365-368; ISBN 9798350360400
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2024,
Ardeshirpour Y, Guag J, Silberberg JL, Seidman SJ
2024 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), Phoenix, AZ, USA. IEEE: S. 359-364; ISBN 9798350360400
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2024,
Jacksha RD, Sunderman CB, Zhou C
2024 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), Phoenix, AZ, USA. IEEE: S. 205-210; ISBN 9798350360400