Die folgenden Begriffe wurden einbezogen:
Elektronik, electronics, 電子工学、電子機器
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2020,
Wagih M, Komolafe A, Zaghari B
IEEE Access 8: 24630-24642
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2020,
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Magn Reson Med 84 (2): 1061-1075
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2020,
Kozlov M, Kainz W, Daniel L
IEEE Trans Microw Theory Tech 68 (2): 509-515
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IET Microwaves, Antennas & Propagation 14 (2): 177-184
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2020,
Khadir Fall A, Lemoine C, Besnier P, Sauleau R, Le Dréan Y, Zhadobov M
Bioelectromagnetics 41 (2): 121-135
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2020,
Wu J, Qi Y, Gong G, Fan J, Miao M, Yu W, Ma J, Drewniak JL
IEEE Trans Electromagn Compat 62 (6): 2604-2612
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StatPearls
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Bioelectromagnetics 41 (1): 3-20
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2020,
Li W, Wang Q, Kang J, Wang J
IEEE Trans Ind Electron 67 (12): 10410-10420
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2020,
Cotelli M, Manenti R, Ferrari C, Gobbi E, Macis A, Cappa SF
Neurosci Biobehav Rev 108: 498-525
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2020,
Masood S, Saleem I, Smith D, Chu WK
Curr Microbiol 77 (2): 194-203
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2020,
Fernandez M, Espinosa HG, Guerra D, Peña I, Thiel DV, Arrinda A
Bioelectromagnetics 41 (1): 73-79
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2020,
Lennerz C, Horlbeck L, Weigand S, Grebmer C, Blazek P, Brkic A, Semmler V, Haller B, Reents T, Hessling G, Deisenhofer I, Lienkamp M, Kolb C, O'Connor M
Technol Health Care 28 (1): 1-12
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2020,
Kumar A, Kaur S, Chandel S, Singh HP, Batish DR, Kohli RK
Ecotoxicol Environ Saf 188: 109786
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2020,
Huang L, Chen C, Li Z, Zhang Y, Zhang H, Lu J, Ruan S, Zeng Y
Nanotechnology 31 (16): 162001
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2020,
Seo S, Jo H, Bien F
IEEE Transactions on Power Electronics 35 (5): 4518-4532
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2020,
Zada M, Shah IA, Yoo H
IEEE Trans Antennas Propag 68 (2): 1140-1144
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IEEE J Electromagn RF Microw Med Biol 4 (3): 157-163
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2020,
Xie YJ, Gao Q, He CQ, Bian R
Arch Phys Med Rehabil 101 (1): 130-140
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2020,
He Y, Li K, Chen Q, Yin J, Bai D
Am J Phys Med Rehabil 99 (2): 99-108
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2020,
Bunke C, Hashikawa AN, Mitra A
Ann Emerg Med 75 (1): 90-92
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2020,
Attaran A, Handler WB, Chronik BA
IEEE J Electromagn RF Microw Med Biol 4 (1): 2 - 9
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2020,
Jones ML, Morris JT, Mueller JL, Lippincott B, Sweatman WM
Assist Technol 32 (4): 173-181
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2019,
Chow JPW, Chung HSH, Chan LLH, Shen R, Tang SC
IEEE Transactions on Power Electronics 34 (10): 9779-9793
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IEEE Trans Compon Packaging Manuf Technol 9 (7): 1253-1263
