-
2020,
Sales MVG, Lima BS, Acosta-Avalos D
Eur Biophys J 49 (7): 633-642
-
2020,
Ruiz-Cabello N M, Abaļenkovs M, Diaz Angulo LM, Cobos Sanchez C, Moglie F, Garcia SG
PLoS One 15 (9): e0238115
-
2020,
Ye E, Lee S, Park W, Park E, Cho DW, Jang J, Park SM
IEEE Access 8: 194363-194372
-
2020,
Turco CV, Arsalan SO, Nelson AJ
Brain Sci 10 (10): E751
-
2020,
El-Hajj AM, Naous T
2020 IEEE 3rd 5G World Forum (5GWF), Bangalore, India. IEEE: 448-453; ISBN 978-1-7281-7300-9
-
2020,
Djekidel R, Bessedik SA, Akef S
IET Sci Meas Technol 14 (8): 914-923
-
2020,
Shokri M, Shamsaei ME, Malekshah AK, Amiri FT
Andrologia 52 (11): e13834
-
2020,
Bisson JI, van Gelderen M, Roberts NP, Lewis C
Eur J Psychotraumatol 11 (1): 1795361
-
2020,
Serdyukov DS, Goryachkovskaya TN, Mescheryakova IA, Bannikova SV, Kuznetsov SA, Cherkasova OP, Popik VM, Peltek SE
Biomed Opt Express 11 (9): 5258-5273
-
2020,
Chang J, Shen D, Wang Y, Wang N, Liang Y
Appl Bionics Biomech 2020: 8882430
-
2020,
Pinchera D, Migliore MD, Schettino F
IEEE Access 8: 182787-182800
-
2020,
Dasdag O, Adalier N, Dasdag S
Biotechnol Biotechnol Equip 34 (1): 1087-1094
-
2020,
Mahoney 3rd JJ, Hanlon CA, Marshalek PJ, Rezai AR, Krinke L
J Neurol Sci 418: 117149
-
2020,
Colombini A, Perucca Orfei C, Vincenzi F, De Luca P, Ragni E, Viganò M, Setti S, Varani K, de Girolamo L
PLoS One 15 (9): e0239807
-
2020,
Lu H, Guo J, Hong X, Chen A, Zhang X, Shen S
Medicine 99 (39): e22256
-
Cureus 12 (8): e9934
-
2020,
Johnsen S, Lohmann KJ, Warrant EJ
J Exp Biol 223 Pt 18: jeb164921
-
2020,
Vinhas A, Rodrigues MT, Gonçalves AI, Reis RL, Gomes ME
Acta Biomater 117: 235-245
-
2020,
Konstantinos S, Vikelis M, Rapoport A
J Neuroophthalmol 40 (4): 472-484
-
2020,
Yang C, Xu H, Wang R, Liu Y, Wang S
Ann Palliat Med 9 (5): 3357-3365
-
2020,
Tariq RU, Ye M, Cao Z, He Y
2020 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP), Suzhou, China. IEEE: 1-3; ISBN 978-1-7281-6065-8
-
2020,
Zhao L, Liu W, Lian J, Shen M, Huo X
J Environ Manage 276: 111328
-
2020,
Rumeng T, Ying S, Tong W, Wentao Z
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: 659-662; ISBN 978-1-7281-7431-0
-
2020,
Kohan M, Jakusova V, Jakus J, Zivcak J, Hudak R, Schnitzer M, Jancosek M, Ivankova J
2020 ELEKTRO, Taormina, Italy. IEEE: 1-5; ISBN 978-1-7281-7543-0
-
2020,
Muri L, Oberhänsli S, Buri M, Le ND, Grandgirard D, Bruggmann R, Müri RM, Leib SL
PLoS One 15 (9): e0232863