-
IEEE J Electromagn RF Microw Med Biol 1 (1): 34 - 40
-
IEEE J Electromagn RF Microw Med Biol 1 (1): 2 - 13
-
2017,
Chiaramello E, Parazzini M, Fiocchi S, Ravazzani P, Wiart J
IEEE J Electromagn RF Microw Med Biol 1 (1): 26 - 33
-
2024,
Attoun Z, Shafi N, Tawk Y, Costantine J, Shammas E
IEEE J Microw 4 (2): 193-203
-
2023,
Wagih M, Balocchi L, Benassi F, Carvalho NB, Chiao JC, Correia R, Costanzo A, Cui Y, Georgiadou D, Gouveia C, Grosinger J, Ho JS, Hu K, Komolafe A, Lemey S, Loss C, Marrocco G, Mitcheson P, Palazzi V, Panunzio N, Paolini G, Pinho P, Preishueber-Pflugl J, Qaragoez Y, Rahmani H, Rogier H, Lopera JR, Roselli L, Schreurs D, Tentzeris M, Tian X, Torah R, Torres R, Van Torre P, Vital D, Beeby S
IEEE J Microw 3 (1): 193-226
-
2022,
Ito R, Jeon S, Wang J, Lee AK, Pack JK, Choi HD, Ahn YH, Imaida K
IEEE J Microw 2 (3): 522-532
-
IEEE J Microw 2 (1): 23-27
-
2024,
López-Soriano S, Melià-Seguí J, Parrón Granados J
IEEE J Radio Freq Identif 8: 125-133
-
2023,
Mugisha AJ, Rigi A, Podilchak S, Mitra S
IEEE J Radio Freq Identif 7: 182-191
-
2022,
Occhiuzzi C, Venturi FR, Amato F, Di Carlofelice A, Tognolatti P, Marrocco G
IEEE J Radio Freq Identif 6: 629-636
-
2020,
Amato F, Occhiuzzi C, Marrocco G
IEEE J Radio Freq Identif 4 (3): 176-185
-
2019,
Miozzi C, Saggio G, Gruppioni E, Marrocco G
IEEE J Radio Freq Identif 3 (4): 236 - 244
-
2023,
Zhang Y, Yang C, Chang Z, Li Z, Gao H, Luo Y, Xu K, Pan G, Zhao B
IEEE J Solid-State Circuits 58 (11): 3194-3206
-
2019,
Maity S, Chatterjee B, Chang G, Sen S
IEEE J Solid-State Circuits 54 (10): 2892-2906
-
IEEE J Solid-State Circuits 54 (11): 3031-3042
-
2019,
Abdi A, Aliakbarian H
IEEE J Transl Eng Health Med 7: 1-11
-
2020,
Shikhantsov S, Thielens A, Vermeeren G, Demeester P, Martens L, Torfs G, Joseph W
IEEE Communications Society 38 (9): 1955-1963
-
2024,
Galdino F, Silva J, Silva G, Pinheiro F, Rodrigues M, Sousa V, Barbosa H, Silva R, Carvalho V, Medeiros L, Silva J
IEEE Latin America Transactions 22 (1): 31-38
-
2013,
Rodriguez CJ, Vanella OR, Bruni RG, Taborda RAM
IEEE Latin America Transactions 11 (1): 319-323
-
2022,
Yang B, Chen CH, Graham SJ
IEEE Letters on Electromagnetic Compatibility Practice and Applications 4 (3): 83-87
-
2020,
Fiedler TM, Ladd ME, Clemens M, Bitz AK
IEEE Letters on Electromagnetic Compatibility Practice and Applications 2 (3): 85-91
-
IEEE Microw Mag 23 (1): 10-17
-
IEEE Microw Mag 21 (9): 16-19
-
IEEE Microw Mag 21 (4): 15-17
-
IEEE Microw Mag 20 (11): 18 - 21