-
2023,
Meng X, Xiao X, Jeon S, Kim D, Park BJ, Kim YJ, Rubab N, Kim S, Kim SW
Adv Mater 35 (12): e2209054
-
2023,
Unal G, Poon C, FallahRad M, Thahsin M, Argyelan M, Bikson M
Brain Stimul [im Druck]
-
2023,
Rakoczy R, Nowak A, Konopacki M, Kordas M, Kucharski Ł, Ossowicz-Rupniewska P
Eur J Pharm Biopharm 185: 183-189
-
2023,
Hardell L, Nilsson M
Ann Case Rep 8 (1): 1112
-
2023,
Wang Y, Liu H, Zeng P, Ji L, Zhou Y, Zhou L, Tao Y
Front Neurosci 17: 1114962
-
2023,
Kimsa-Dudek M, Krawczyk A, Synowiec-Wojtarowicz A
Appl Sci 13 (3): 1470
-
2023,
Madl P, Germano R, Tedeschi A, Lettner H
Int J Mol Sci 24 (4): 4099
-
2023,
Kim BR, Kim M, Kim JW, Shin JW, Na JI, Huh CH
Dermatol Surg [im Druck]
-
2023,
Vergote I, Macarulla T, Hirsch FR, Hagemann C, Miller DS
Cancers 15 (3): 636
-
2023,
Szilágyi Z, Németh Z, Bakos J, Kubinyi G, Necz PP, Szabó E, Thuróczy G, Pinto R, Selmaoui B
Int J Mol Sci 24 (3): 2853
-
2023,
Ali U, Ullah S, Kamal B, Matekovits L, Altaf A
IEEE Access 11: 14458-14486
-
Health Phys [im Druck]
-
J Therm Eng 9 (1): 257–259
-
2023,
Shaner S, Savelyeva A, Kvartuh A, Jedrusik N, Matter L, Leal J, Asplund M
Lab Chip 23 (6): 1531-1546 [im Druck]
-
Environ Res 222: 115369
-
2023,
Li K, Kodera S, Poljak D, Diao Y, Sasaki K, Susnjara A, Prokop A, Taguchi K, Xi J, Zhang S, Yao M, Sacco G, Zhadobov M, El Hajj W, Hirata A
IEEE Access 11: 7420-7435
-
2023,
Zanotti F, Trentini M, Zanolla I, Tiengo E, Mantarro C, Dalla Paola L, Tremoli E, Sambataro M, Sambado L, Picari M, Leo S, Ferroni L, Zavan B
Int J Mol Sci 24 (2): 1754
-
2023,
Vives L, Ielpi M, Sosa MT, Risk M, Patiño O
IEEE Latin America Transactions 21 (1): 175-180
-
2023,
Fatani F, Vaseem M, Akhter Z, Bilal RM, Shamim A
IEEE Sens J 23 (1): 169-180
-
2023,
Labadie JG, Chilukuri S, Cohen J, Kilmer S, Lupo M, Rohrich R, Dover JS
Dermatol Surg 49 (1): 54-59
-
2023,
Kapetanović AL, Sacco G, Poljak D, Zhadobov M
IEEE J Electromagn RF Microw Med Biol 7 (1): 39-45
-
2023,
Chiao JC, Li C, Lin J, Caverly RH, Hwang JCM, Rosen H, Rosen A
IEEE J Microw 3 (1): 134-169
-
2023,
Bluhm R, Cortright M, Achtyes ED, Cabrera LY
AJOB Neurosci 14 (1): 1-12
-
2023,
Hossain R, Sinyor M, Nestor S, Richter MA, Lipsman N, Hamani C, Giacobbe P
Psychiatry Res 319: 115007
-
2023,
Qureshi MRA, Alfadhl Y, Chen X
Low Electromagnetic Field Exposure Wireless Devices: Fundamentals and Recent Advances. Ur Rehman M, Jamshed MA (Hrsg.): Wiley-IEEE Press: 49-75, ISBN 978-1-119-90916-3
-
2023,
Jamshed MA, Héliot F, Brown TWC, Ur Rehman M
Low Electromagnetic Field Exposure Wireless Devices: Fundamentals and Recent Advances. Ur Rehman M, Jamshed MA (Hrsg.): Wiley-IEEE Press: 225-236, ISBN 978-1-119-90916-3
-
2023,
Huang L, Liu Y, Fang W, Liu L, Sun Q, Lin X, Xu H, Yang Y
J Cosmet Dermatol 22 (2): 497-504
-
2023,
Rezapour A, Arabloo J, Moradi N, Ehsanzadeh SJ, Hourzad M, Alipour V
Aesthetic Plast Surg 47 (1): 378-386
-
2023,
Haider Z, Modolo J, Liberti M, Apollonio F, Zhadobov M
IEEE J Microw 3 (1): 170-180
-
IEEE Access 11: 16466-16473
-
2023,
Dundar AS, Oruc M, Celbis O, Samdanci ET, Akatli AN, Okumus H, Taskapan C, Ozhan O, Parlakpinar H
Int J Legal Med 137 (1): 215–226
-
2022,
Zhang Y, Li Q, Wang C, Zhu L, Wang F, Jiao W, Zhuang X, Xie F, Du L, Jin Y
Biomed Pharmacother 155: 113779
-
2022,
Gül BD, Şentürk N, Bayçelebi D, Yıldız L
Turkderm-Turk Arch Dermatol Venereol 56 (4): 193-196
-
2022,
Anadkat MJ, Lacouture M, Friedman A, Horne ZD, Jung J, Kaffenberger B, Kalmadi S, Ovington L, Kotecha R, Abdullah HI, Grosso F
Front Oncol 12: 975473
-
2022,
Matveev I, Zhorina L, Shishkin Y
2022 IEEE International Multi-Conference on Engineering, Computer and Information Sciences (SIBIRCON), Yekaterinburg, Russian Federation. IEEE: 440-445, ISBN 978-1-6654-6481-9
-
2022,
Zhang Z, Wu C, Yang J, Liu J, Yi Li, Liu L, Kong M, Zhang J, Jiang X
Heliyon 8 (12): e12421
-
2022,
Fereidouni F, Mohammadi ST, Faramarzi Shahraki V, Jahantigh F
J Biomed Phys Eng 12 (3): 285-296
-
2022,
Martusevich A, Kishoyan K, Surovegina A, Golygina E, Bocharin I, Nazarov V
Arch EuroMedica 12 (2): 12-14
-
2022,
Yamamoto K, Hikage T, Masuda H, Ishitake T, Li K, Nagai A
2022 International Symposium on Antennas and Propagation (ISAP). IEEE: 277-278, ISBN 978-1-6654-7963-9
-
2022,
Yamamoto K, Hikage T, Masuda H, Ishitake T, Li K, Nagai A
2022 IEEE International Workshop on Electromagnetics: Applications and Student Innovation Competition (iWEM), Narashino, Japan. IEEE: 37-38, ISBN 978-1-6654-3239-9
-
2022,
Minier L, Debouzy JC, Foerster M, Pierre V, Maindet C, Crouzier D
Electromagn Biol Med: 1-9 [im Druck]
-
J Cosmet Dermatol 21 (11): 5657-5664
-
2022,
Cruz Almeida DdV, de Albuquerque Lopes CT, Magalhães-Matos PC, Pereira Junior JJ, Imbeloni AA, Souza Domingues SF
Acta Sci Vet 50 Suppl 1
-
2022,
Wolff CM, Bekeschus S
Int J Mol Sci 23 (23): 14772
-
2022,
Vespa S, Stumpp L, Liberati G, Delbeke J, Nonclercq A, Mouraux A, El Tahry R
Brain Stimul 15 (6): 1498-1507
-
2022,
Delgado AR, Chapas A
J Cosmet Dermatol 21 Suppl 1: S1-S10
-
2022,
Asadi K, Aris A, Fouladpour A, Ghazanfari MJ, Karkhah S, Salari A
Burns 48 (8): 2013-2014
-
2022,
Nguyen L, Blessmann M, Schneider SW, Herberger K
Dermatol Surg 48 (12): 1299-1305
-
2022 3rd International Conference on Smart Electronics and Communication (ICOSEC). IEEE: 590-594, ISBN 978-1-6654-9765-7
-
2022,
Wu YT, Zhang Z, Ji R, Zhang SH, Wang WP, Wu C, Zhang JP, Jiang XP, Zhang H
Chin J Burns Wounds 38 (11): 1066-1072