Die folgenden Begriffe wurden einbezogen:
Implantat, implant, インプラント
-
2019,
Biswas DK, Tasneem NT, Mahbub I
2019 IEEE Texas Symposium on Wireless and Microwave Circuits and Systems (WMCS), Waco, TX, USA. IEEE: S. 1-6; ISBN 978-1-7281-1804-8
-
IEEE Trans Compon Packaging Manuf Technol 9 (7): 1253-1263
-
Jaroszewski M, Thomas S, Rane AV (Hrsg.): Advanced Materials for Electromagnetic Shielding: Fundamentals, Properties, and Applications. John Wiley & Sons, Inc.; S. 11-33; ISBN 978-1-119-12861-8
-
2019,
Dinis H, Colmiais I, Mendes PM
2019 17th IEEE International New Circuits and Systems Conference (NEWCAS), Munich, Germany. IEEE: S. 1-4; ISBN 978-1-7281-1032-5
-
2019 International Conference on Robotics,Electrical and Signal Processing Techniques (ICREST), Dhaka, Bangladesh. IEEE: S. 253-257; ISBN 978-1-5386-8015-5
-
2019,
Ahmad MS, Rahman MM, Morshed KM
2019 5th International Conference on Advances in Electrical Engineering (ICAEE), Dhaka, Bangladesh. IEEE: S. 617-622; ISBN 978-1-7281-4935-6
-
2019,
Bernety HM, Puckett RD, Schurig D, Furse C
IEEE Antennas Wirel Propag Lett 18 (6): 1189-1193
-
2019,
Manoufali M, Bialkowski K, Mohammed B, Mills PC, Abbosh AM
IEEE Trans Antennas Propag 67 (8): 4955-4967
-
2019 IEEE International Conference on Computational Electromagnetics (ICCEM), Shanghai, China. IEEE: S. 1-3; ISBN 978-1-5386-7112-2
-
2019,
Ben Saada A, Ben Mbarek S, Choubani F
2019 15th International Wireless Communications & Mobile Computing Conference (IWCMC), Tangier, Morocco. IEEE: S. 1430-1433; ISBN 978-1-5386-7748-3