Die folgenden Begriffe wurden einbezogen:
Leitfähigkeit, conductivity, conductance, 伝導率
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2023,
Šušnjara A, Poljak D, Galić M
2023 8th International Conference on Smart and Sustainable Technologies (SpliTech), Split/Bol, Croatia. IEEE: 1-6; ISBN 9798350323207
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2023,
Binti Bani Hashim SN, Nik Ali NH, Abd Rahman MS, Johari D, Abdul Haris F, Ab Kadir MZA
2023 12th Asia-Pacific International Conference on Lightning (APL), Langkawi, Malaysia. IEEE: 1-6; ISBN 978-1-6654-5686-9
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bioRxiv: the Preprint Server for Biology (bioRxiv),
2023.01.13.523921
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2023,
Lee S, Shirinpour S, Alekseichuk I, Perera N, Linn G, Schroeder CE, Falchier AY, Opitz A
bioRxiv: the Preprint Server for Biology (bioRxiv),
2023.04.07.536090
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2022,
Tamura M, Segawa T, Matsumoto M
2022 Asia-Pacific Microwave Conference (APMC), Yokohama, Japan. IEEE: 58-60; ISBN 978-1-6654-5108-6
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2022,
Ramirez-Bettoni E, Nemeth B
2022 IEEE IAS Electrical Safety Workshop (ESW), Jacksonville, FL, USA. IEEE: 1-9; ISBN 978-1-6654-7864-9
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2022,
Jeladze V, Shoshiashvili L, Partsvania B
2022 IEEE 2nd Ukrainian Microwave Week (UkrMW), Ukraine. IEEE: 477-481; ISBN 9798350331530
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2022,
Silue D, Choubani F, Labidi M
2022 18th International Conference on Wireless and Mobile Computing, Networking and Communications (WiMob), Thessaloniki, Greece. IEEE: 278-283; ISBN 978-1-6654-6976-0
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2022,
Mahmood SN, Saeidi T, Ismael AR, Alani S
2022 International Symposium on Multidisciplinary Studies and Innovative Technologies (ISMSIT), Ankara, Turkey. IEEE: 679-686; ISBN 978-1-6654-7014-8
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2022 IEEE 9th International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications (MAPE), Chengdu, China. IEEE: 319-322; ISBN 978-1-6654-2776-0