-
2022,
Hough CM, Purschke DN, Bell C, Kalra AP, Oliva PJ, Huang C, Tuszynski JA, Warkentin BJ, Hegmann FA
2022 47th International Conference on Infrared, Millimeter and Terahertz Waves (IRMMW-THz), Delft, Netherlands. IEEE: 1-3; ISBN 978-1-7281-9428-8
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2021,
Bomzon Z, Wenger C, Proescholdt M, Mohan S
Brain and Human Body Modeling 2020. Springer, Cham (CH): 3-17; ISBN 978-3-030-45622-1
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2020,
Hough CM, Purschke DN, Huang C, Titova LV, Kovalchuk O, Warkentin BJ, Hegmann FA
2020 45th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz), Buffalo, NY, USA. IEEE: 1-2; ISBN 978-1-7281-6621-6
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2020,
Halašová E, Tóthová B, Kmeťová Sivoňová M, Okajčeková T, Škovierová H, Špánik P, Pavelek M, Frivaldský M
2020 ELEKTRO, Taormina, Italy. IEEE: 1-6; ISBN 978-1-7281-7543-0
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2019,
Migahid MM, El-Bakatoushi RF, Megahed SM, Amin AW, El-Sadek LM
Proceedings of 2019 6th International Conference Bioinformatics Research and Applications (ICBRA '19), Seoul, Republic of Korea. Association for Computing Machinery, New York, NY, USA: 96-104; ISBN 978-1-4503-7218-3
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2019,
Mescia L, Chiapperino MA, Bia P, Lamacchia CM, Gielis J, Caratelli D
2019 PhotonIcs & Electromagnetics Research Symposium - Spring (PIERS-Spring), Rome, Italy. IEEE: 2992-2998; ISBN 978-1-7281-3404-8
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2019,
Hough CM, Purschke DN, Huang C, Titova LV, Kovalchuk O, Warkentin BJ, Hegmann FA
2019 44th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz), Paris, France. IEEE: 1-3; ISBN 978-1-5386-8286-9
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2018 IEEE International Symposium on Signal Processing and Information Technology (ISSPIT), Louisville, KY, USA. IEEE: 1-5; ISBN 978-1-5386-7569-4
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2016,
Wenger C, Bomzon Z, Salvador R, Basser PJ, Miranda PC
2016 38th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), Orlando, FL, USA. IEEE: 5664-5667; ISBN 978-1-4577-0220-4
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2016,
Hershkovich HS, Bomzon Z, Wenger C, Urman N, Chaudhry A, Garcia-Carracedo D, Kirson ED, Weinberg U, Wassermann Y, Palti Y
2016 38th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), Orlando, FL, USA. IEEE: 2357-2360; ISBN 978-1-4577-0220-4