Die folgenden Begriffe wurden einbezogen:
Nährmedium, Kulturmedium, Medium, "culture medium", 培地, 媒質
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2022,
Georgakis IP, Villena JF, Polimeridis AG, Lattanzi R
IEEE Trans Antennas Propag 70 (9): 8227-8241
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2022,
Muthuselvi M, Bharathi R, Sherby MG, Jeya JM, Reshma S
2022 International Conference on Augmented Intelligence and Sustainable Systems (ICAISS), Trichy, India. IEEE: 689-694; ISBN 978-1-6654-8963-8
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2022,
Nozadze T, Henke K, Kurtsikidze M, Jeladze V, Ghvedashvili G, Zaridze R
2022 IEEE 2nd Ukrainian Microwave Week (UkrMW), Ukraine. IEEE: 439-443; ISBN 9798350331530
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2022,
Mocanu M, Huchitu A, Gandescu CH, Gkanatsios S
UPB Sci Bull, Series C: Electr Eng Comput Sci 84 (4): 323-338
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2022,
Badwey MA, Abbasy NH, Eldallal GM
2022 23rd International Middle East Power Systems Conference (MEPCON), Cairo, Egypt. IEEE: 1-8; ISBN 978-1-6654-6364-5
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2022,
Miclaus S, Deaconescu DB, Vatamanu D, Buda AM
2022 International Symposium on Electronics and Telecommunications (ISETC), Timisoara, Romania. IEEE: 1-4; ISBN 978-1-6654-5151-2
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2022,
Martusevich A, Kishoyan K, Surovegina A, Golygina E, Bocharin I, Nazarov V
Arch EuroMedica 12 (2): 12-14
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2022,
Kim D, Kim M, Lee S, Lee Y, Kim Y
2022 9th International Conference on Condition Monitoring and Diagnosis (CMD), Kitakyushu, Japan. IEEE: 687-690; ISBN 978-1-6654-7015-5
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2022,
Zhou H, Zhang R, Tian Y, Peng H, Wang H, Mao J
2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), Urbana, IL, USA. IEEE: 1-3; ISBN 978-1-6654-9195-2
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2022,
Bannikova S, Khlebodarova T, Vasilieva A, Mescheryakova I, Bryanskaya A, Shedko E, Popik V, Goryachkovskaya T, Peltek S
Int J Mol Sci 23 (23): 15216