Die folgenden Begriffe wurden einbezogen:
Störabstand, Signal-Rausch-Verhältnis, S/N, SNR, "signal-to-noise ratio", 信号対雑音比
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2023,
Galanis C, Neuhaus L, Hananeia N, Turi Z, Jedlicka P, Vlachos A
bioRxiv: the Preprint Server for Biology (bioRxiv),
2023.09.25.559399
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2023,
Bujard C, Douglas M, Jain N, Neufeld E, Wiart J, Kuster N
2023 XXXVth General Assembly and Scientific Symposium of the International Union of Radio Science (URSI GASS), Sapporo, Japan. IEEE: 1-4; ISBN 9798350309973
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2023,
Comelli M, Zoppetti N
2023 XXXVth General Assembly and Scientific Symposium of the International Union of Radio Science (URSI GASS), Sapporo, Japan. IEEE: 1-3; ISBN 9798350309973
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2023,
Yamazaki K, Tamura N, Miyashita C, Yoshikawa T, Ikeda-Araki A, Hikage T, Omiya M, Mizuta M, Ikuyo M, Tobita K, Onishi T, Taki M, Watanabe S, Kishi R
2023 XXXVth General Assembly and Scientific Symposium of the International Union of Radio Science (URSI GASS), Sapporo, Japan. IEEE: 1-2; ISBN 9798350309973
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2023,
Liu S, Tsuchiya N, Onishi T, Taki M, Watanabe S, Suzuki Y
2023 XXXVth General Assembly and Scientific Symposium of the International Union of Radio Science (URSI GASS), Sapporo, Japan. IEEE: 1-3; ISBN 9798350309973
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2023,
Douglas M, Jain N, Kochali B, Kuster N
2023 XXXVth General Assembly and Scientific Symposium of the International Union of Radio Science (URSI GASS), Sapporo, Japan. IEEE: 1-3; ISBN 9798350309973
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2023,
Jordan T, Apostol MR, Nomi J, Petersen N
bioRxiv: the Preprint Server for Biology (bioRxiv),
2023.09.12.557465
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2023,
Parsa N, Sanphuang V
2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI), Grand Rapids, MI, USA. IEEE: 655; ISBN 9798350309775
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2023,
Boukabou I, Rupanetti D, Kaabouch N, Foust L
2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI), Grand Rapids, MI, USA. IEEE: 413-418; ISBN 9798350309775
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2023,
Liu H, Gong N, Ni H, Yang S
2023 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting (USNC-URSI), Portland, OR, USA. IEEE: 1437-1438; ISBN 978-1-6654-4229-9