Die folgenden Begriffe wurden einbezogen:
attention, Aufmerksamkeit, 注意
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2019,
Chi PY, Spuul P, Tseng FG, Genot E, Chou CF, Taloni A
La Porta CAM, Zapperi S (Hrsg.): Cell Migrations: Causes and Functions. Advances in Experimental Medicine and Biology, Band 1146; Springer, New York; 79-103; ISBN 978-3-030-17592-4
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2019,
Danker-Hopfe H, Dorn H, Eggert T, Sauter C
Bundesamt für Strahlenschutz (BfS),
Ressortforschungsberichte zur kerntechnischen Sicherheit und zum Strahlenschutz, BfS-RESFOR-143/19: 1-226
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2018,
Salceanu A, Ursache S, Asiminicesei OM, Lazarescu C
2018 International Conference and Exposition on Electrical And Power Engineering (EPE), Iasi, Romania. IEEE: 759-764; ISBN 978-1-5386-5063-9
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2018,
Zradzinski P, Karpowicz J, Gryz K, Leszko W
Eskola H, Väisänen O, Viik J, Hyttinen J (Hrsg.): EMBEC & NBC 2017: Joint Conference of the European Medical and Biological Engineering Conference (EMBEC) and the Nordic-Baltic Conference on Biomedical Engineering and Medical Physics (NBC), Tampere, Finland, June 2017. IFMBE Proceedings, Band 65; Springer, Singapore; 1008-1011; ISBN 978-981-10-5121-0
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2018,
Herrala M, Kumari K, Blomme A, Khan MW, Koivisto H, Naarala J, Roivainen P, Tanila H, Viluksela M, Juutilainen J
Eskola H, Väisänen O, Viik J, Hyttinen J (Hrsg.): EMBEC & NBC 2017: Joint Conference of the European Medical and Biological Engineering Conference (EMBEC) and the Nordic-Baltic Conference on Biomedical Engineering and Medical Physics (NBC), Tampere, Finland, June 2017. IFMBE Proceedings, Band 65; Springer, Singapore; 719-722; ISBN 978-981-10-5121-0
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2018,
Mortazavi SMJ, Balas VE, Zamani A, Zamani A, Mortazavi SAR, Haghani M, Jaberi O, Soleimani A
Balas VE, Jain LC, Balas MM (Hrsg.): Soft Computing Applications. SOFA 2016. Advances in Intelligent Systems and Computing, Band 633; Springer, Cham; 316-326; ISBN 978-3-319-62520-1
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2018 3rd International Conference and Workshops on Recent Advances and Innovations in Engineering (ICRAIE), Jaipur, India. IEEE: 1-6; ISBN 978-1-5386-4526-0
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2018,
Cui H, Wei J, Ke Y, An X, Sun C, Xu M, Qi H, Ming D, Zhou P
2018 40th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), Honolulu, HI, USA. IEEE: 3481-3484; ISBN 978-1-5386-3647-3
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2018,
Karpowicz J, De Miguel-Bilbao S, Zradzńnski P, Gryz K, Falcone F, Ramos V
2018 International Symposium on Electromagnetic Compatibility (EMC EUROPE), Amsterdam, Netherlands. IEEE: 972-975; ISBN 978-1-4673-9699-8
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2018 26th Telecommunications Forum (TELFOR), Belgrade, Serbia. IEEE: 1-3; ISBN 978-1-5386-7172-6