Die folgenden Begriffe wurden einbezogen:
electromagnetic, elektromagnetisch, 電磁気の
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2019,
Sasaki K, Li K, Wake K, Watanabe S, Higashiyama J, Onishi T
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: S. 43-46; ISBN 978-1-7281-1639-6
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2019,
Miwa K, Takenaka T, Hirata A
IEEE Trans Electromagn Compat 61 (6): 2024-2030
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2019,
Zachepa N, Chorna O, Rieznik D
2019 IEEE International Conference on Modern Electrical and Energy Systems (MEES), Kremenchuk, Ukraine. IEEE: S. 158-161; ISBN 978-1-7281-2570-1
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2019,
Mondal SP, Padmini TN
2019 International Conference on Vision Towards Emerging Trends in Communication and Networking (ViTECoN), Vellore, India. IEEE: S. 1-4; ISBN 978-1-5386-9354-4
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2019,
Rieznik D, Zachepa I, Zachepa N, Sukach S, Chenchevoi V, Vovna O
2019 IEEE International Conference on Modern Electrical and Energy Systems (MEES), Kremenchuk, Ukraine. IEEE: S. 198-201; ISBN 978-1-7281-2570-1
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2019,
Gao G, Zhang R, Yang C, Meng H, Geng W, Hu B
IET Microwaves, Antennas & Propagation 13 (13): 2319 - 2323
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2019,
Lan Q, Zheng J, Chen J
2019 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting, Atlanta, GA, USA. IEEE: S. 1861-1862; ISBN 978-1-7281-0693-9
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2019,
Phaneuf M, Mojabi P
2019 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting, Atlanta, GA, USA. IEEE: S. 533-534; ISBN 978-1-7281-0693-9
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2019,
Shiina T, Yamazaki K
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: S. 744-747; ISBN 978-1-7281-1639-6
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2019,
Kageyama I, Masuda H, Morimatsu Y, Ishitake T, Sakakibara K, Hikage T, Hirata A
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: S. 766-769; ISBN 978-1-7281-1639-6