[ミリ波の有限要素モデリングおよびペルーにおける5G技術の課題] tech./dosim.

Finite element modelling of millimeter waves and the challenges in 5G technology in Peru

掲載誌: 2022 IEEE XXIX International Conference on Electronics, Electrical Engineering and Computing (INTERCON), Lima, Peru. IEEE, 2022: 1-4; ISBN 978-1-6654-8637-8

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