[1.5 T での組織縮小仮想ファミリーモデルにおける受動的デバイスの高周波誘起加熱評価] dev./impl.

RF-induced Heating Evaluation for Passive Device in Tissue-Reduced Virtual Family Models at 1.5 T

掲載誌: 2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Spokane, WA, USA. IEEE, 2022: 610-613; ISBN 978-1-6654-0930-8

ばく露