キーワード:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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2021,
Lottner T, Reiss S, Bitzer A, Bock M, Özen AC
IEEE Trans Electromagn Compat 63 (3): 662-672
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2021,
Wang Y, Zheng J, Wang Q, Chen J, Kainz W
IEEE Trans Electromagn Compat 63 (3): 673-680
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2021,
Shah IA, Cho Y, Yoo H
IEEE Trans Electromagn Compat 63 (3): 681-691
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2021,
Gifuni A, Grassini G, Buono A, Festa D, Flintoft ID, Gargiulo S, Nunziata F, Migliaccio M
IEEE Trans Electromagn Compat 63 (2): 427-434
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2021,
Hakuta Y, Watanabe T, Takenaka T, Ito T, Hirata A
IEEE Trans Electromagn Compat 63 (1): 313-318
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2022,
Li E, Li XJ, Seet BC
2022 IEEE 9th International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications (MAPE), Chengdu, China. IEEE: 101-104; ISBN 978-1-6654-2776-0
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2022,
Yang X, Guo R, Zheng J, Chen J
2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Spokane, WA, USA. IEEE: 606-609; ISBN 978-1-6654-0930-8
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2022,
Li Y, Liu D, Zhang J, Wu L
2022 International Conference on Mechanical and Electronics Engineering (ICMEE), Xi'an, China. IEEE: 162-166; ISBN 978-1-6654-9221-8
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2022,
Bräunlich R, Dalmus C, Dongus S, Eberhard J, Friedrich G, Fröhlich J, Röösli M, Schürmann D
Swiss Federal Office of Energy (SFOE),
Statusbericht 2022: 1-204
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2022,
Krupski P, Michalowska J
Prz Elektrotechniczny 98 (12): 217-220