キーワード:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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2014,
Chakarothai J, Suzuki Y, Taki M, Kojima M, Sasaki K, Wake K, Watanabe S
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 182-185; ISBN 978-4-88552-287-1
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2014,
Cabot E, Zastrow E, Kuster N
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 237-240; ISBN 978-4-88552-287-1
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2014,
Choi DG, Kim KH, Jang JD, Chung SY, Gimm YM
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 638-641; ISBN 978-4-88552-287-1
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2014,
Kim HS, Lee YH, Choi HD, Lee AK, Lee YS, Pack JK, Kim N, Ahn YH
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 170-173; ISBN 978-4-88552-287-1
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2014,
Suzuki Y, Koike A, Takamura M, Taki M, Kojima M, Sasaki K, Chakarothai J, Wake K, Watanabe S
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 832-835; ISBN 978-4-88552-287-1
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2014,
Neufeld E, Kuster N
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 230-233; ISBN 978-4-88552-287-1
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2014,
Laakso I, Shimamoto T, Hirata A, Feliziani M
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 430-433; ISBN 978-4-88552-287-1
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2014,
Kang WG, Alexander Z, Jun HY, Park YH, Pack JK
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 198-201; ISBN 978-4-88552-287-1
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2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 194-197; ISBN 978-4-88552-287-1
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2014,
Arima T, Uno T, Wake K, Fujii K, Watanabe S
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 529-532; ISBN 978-4-88552-287-1
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2014,
Shimizu HO, Shimizu K
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 162-165; ISBN 978-4-88552-287-1
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2014,
Higashiyama J, Tarusawa Y
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 650-653; ISBN 978-4-88552-287-1
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2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 625-628; ISBN 978-4-88552-287-1
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2014,
Miyaji Y, Shimada M, Mizuno Y, Naito K
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 621-624; ISBN 978-4-88552-287-1
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2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 206-209; ISBN 978-4-88552-287-1
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German Commission for Electrical, Electronic & Information Technologies of DIN and VDE (DKE),
DIN EN 61786-1 VDE 0848-786-1:2014-10
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Dokument Nr. R1174712004: 1-63
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2013 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC), Melbourne, VIC. IEEE: 1-6; ISBN 978-1-5090-1885-7
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2013 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC), Melbourne, VIC. IEEE: 1-4; ISBN 978-1-5090-1885-7
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2013 IEEE Antennas and Propagation Society International Symposium (APSURSI), Orlando, FL, USA. IEEE: 1432-1433; ISBN 978-1-4673-5317-5
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2013,
Higashiyama J, Tarusawa Y
International Symposium on Electromagnetic Compatibility, Brugge, 2013. IEEE: 93-98; ISBN 978-1-4673-4980-2
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International Symposium on Electromagnetic Compatibility, Brugge, 2013. IEEE: 449-454; ISBN 978-1-4673-4980-2
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2013,
Hirata A, Tsuchida S, Laaskso I
International Symposium on Electromagnetic Compatibility, Brugge, 2013. IEEE: 89-92; ISBN 978-1-4673-4980-2
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2013,
Hikage T, Kawamura Y, Nojima T, Nagaoka T, Watanabe S
International Symposium on Electromagnetic Compatibility, Brugge, 2013. IEEE: 165-168; ISBN 978-1-4673-4980-2
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2013,
Alkahtani AA, Nordin FH, Sharrif ZAM
2013 IEEE International Conference on Control System, Computing and Engineering, Penang, Malaysia. IEEE: 321-324; ISBN 978-1-4799-1508-8
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2013,
Ruddle AR, Low L, Vassilev A
International Symposium on Electromagnetic Compatibility, Brugge, 2013. IEEE: 78-83; ISBN 978-1-4673-4980-2
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International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: 1-6; ISBN 978-1-4673-0718-5
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2012 Asia-Pacific Symposium on Electromagnetic Compatibility, Singapore, 2012. IEEE: 737-740; ISBN 978-1-4577-1557-0
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2012,
Yoshino Y, Igo S, Katsuragi M, Taki M
International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, 2012. IEEE: 13225679; ISBN 978-1-4673-0717-8
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International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, 2012. IEEE: 13225695; ISBN 978-1-4673-0717-8
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2012,
Spathmann O, Hansen V, Streckert J, Zhou Y, Clemens M, Grote K, Klose M, Lerchl A
International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, 2012. IEEE: 13225800; ISBN 978-1-4673-0717-8
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International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, 2012. IEEE: 13225691; ISBN 978-1-4673-0717-8
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[LTE端末のSAR値分析]
[tech./dosim.]
International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, 2012. IEEE: 1-4; ISBN 978-1-4673-0717-8
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International Organization for Standardization (ISO), International Electrotechnical Commission (IEC),
ISO/IEC TR 20017:2011: 1-56
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Association for Electrical, Electronic & Information Technologies (VDE),
VDE-AR-E 2122-4-2:2011-03
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2010 Asia-Pacific International Symposium on Electromagnetic Compatibility, Beijing, China. IEEE: 9-12; ISBN 978-1-4244-5622-2
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German Commission for Electrical, Electronic & Information Technologies of DIN and VDE (DKE),
DIN EN 60601-1-2 VDE 0750-1-2 Berichtigung 1:2010-05
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German Commission for Electrical, Electronic & Information Technologies of DIN and VDE (DKE),
DIN EN 50364 VDE 0848-364:2010-11
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Association for the Advancement of Medical Instrumentation (AAMI),
AAMI TIR18:2010
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2010,
Censi F, Calcagnini G, Mattei E, Triventi M, Bartolini P
2010 Annual International Conference of the IEEE Engineering in Medicine and Biology, Buenos Aires, Argentina. IEEE: 352-355; ISBN 978-1-4244-4123-5
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2009,
Bottauscio O, Chiampi M, Pastorelli M, Pons E, Zilberti L
2009 13th European Conference on Power Electronics and Applications, Barcelona, Spain. IEEE: 1-10; ISBN 978-1-4244-4432-8
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2009,
Capstick M, Kuster N, Kühn S, Berdinas-Torres V, Ladbury J, Koepke G, McCormick D, Gauger J, Melnick R
Proceedings of the Cranfield Multi-Strand Conference: Creating Wealth Through Research and Innovation, CMC 2008. Cranfield University: 533-538; ISBN 978-0-9557436-7-2
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2009,
Hille S, Eichhorn KF, Gonschorek KH
2009 IEEE International Symposium on Electromagnetic Compatibility, Austin, TX, USA. IEEE: 147-152; ISBN 978-1-4244-4266-9
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2008,
Nagaoka T, Saito K, Takahashi M, Ito K, Watanabe S
International Symposium on Electromagnetic Compatibility - EMC Europe, Hamburg, 2008. IEEE; ISBN 978-1-4244-4097-9
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2008,
Hille S, Eichhorn KF, Gonschorek KH
International Symposium on Electromagnetic Compatibility - EMC Europe, Hamburg, 2008. IEEE: 1-5; ISBN 978-1-4244-4097-9
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2007,
Ren DQ, Yang WQ, Zhao T, Li XJ, Zeng GY, Zhang J, Li YR
2007 International Symposium on Electromagnetic Compatibility, Qingdao, China. IEEE: 479-481; ISBN 978-1-4244-1372-0
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2007,
Hirata A, Nagaya Y, Fujiwara O, Nagaoka T, Watanabe S
2007 IEEE International Symposium on Electromagnetic Compatibility, Honolulu, HI, USA. IEEE: 1-4; ISBN 978-1-4244-1349-2
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American National Standards Institute (ANSI), Association for the Advancement of Medical Instrumentation (AAMI),
ANSl/AAMI PC69:2007: 1-81, ISBN 978-1-57020-295-7
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German Commission for Electrical, Electronic & Information Technologies of DIN and VDE (DKE),
DIN EN 60601-1-2 VDE 0750-1-2:2007-12
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2007,
Gruber S, Meier M, Moser M, Ryf S, Burgherr R, Fitzpatrick M, Riederer M, Siegenthaler A, Reusser D
Federal Office of Public Health (FOPH),
1-36