キーワード:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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Electronics 12 (23): 4780
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Energies 15 (12): 4455
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1987,
Reilly JP, Larkin WD
IEEE Trans Electromagn Compat EMC-29 (3): 221-232
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2007,
Ren DQ, Yang WQ, Zhao T, Li XJ, Zeng GY, Zhang J, Li YR
2007 International Symposium on Electromagnetic Compatibility, Qingdao, China. IEEE: 479-481; ISBN 978-1-4244-1372-0
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2019,
Ren X, Liu W, Su Z, Wu H, Qiao S, Lu H, Shen G
2019 12th International Congress on Image and Signal Processing, BioMedical Engineering and Informatics (CISP-BMEI), Suzhou, China. IEEE: 1-5; ISBN 978-1-7281-4853-3
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2005,
Reyhani SM, Ludwig SA
Electromagnetics 25 (2): 93-114
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2000,
Reyhani SMS, Glover RJ
Electromagnetics 20 (2): 141-153
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2023,
Rhee J, Ahn J, Kim H, Lee C, Ahn S
2023 XXXVth General Assembly and Scientific Symposium of the International Union of Radio Science (URSI GASS), Sapporo, Japan. IEEE: 1-4; ISBN 9798350309973
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2020,
Richter A, Ferková Z, Morava J
2020 ELEKTRO, Taormina, Italy. IEEE: 1-6; ISBN 978-1-7281-7543-0
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2006,
Robinson MP, Clegg J, Marvin AC
IEEE Trans Electromagn Compat 48 (2): 304-310