キーワード:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
-
2022,
Xiao C, Hao S, Cheng D, Liao C
IEEE Trans Biomed Circuits Syst 16 (3): 372-383
-
2016,
Xinghai Z, Weimin Z, Hao C
2016 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Shenzhen, China. IEEE: 1160-1163; ISBN 978-1-4673-9494-9
-
2023,
Xinhua P, Xin Z, Huixiong H, Qingfei S, Anxiang L, Wei T, Chao Y, Tong W
2023 IEEE 7th International Symposium on Electromagnetic Compatibility (ISEMC), Hangzhou, China. IEEE: 1-5; ISBN 9798350333114
-
2021,
Xu B, Colombi D, Törnevik C, Ghasemifard F, Chen J
IEEE Trans Electromagn Compat 63 (5): 1680-1689
-
2019,
Xu B, Gustafsson M, Shi S, Zhao K, Ying Z, He S
IEEE Trans Electromagn Compat 61 (2): 327 - 336
-
2023,
Xu Z, Rodriguez-Villegas E
IEEE Trans Biomed Circuits Syst [in press]
-
2023,
Yamaguchi-Sekino S, Ikuyo M, Kamegai K, Taki M, Onishi T, Watanabe S
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland. IEEE: 1-6; ISBN 9798350324013
-
Nihon Hoshasen Gijutsu Gakkai Zasshi 64 (7): 897-901
-
2004,
Yamazaki K, Kawamoto T, Fujinami H, Shigemitsu T
IEEE Trans Electromagn Compat 46 (1): 115-120
-
2022,
Yang B, Chen CH, Graham SJ
IEEE Letters on Electromagnetic Compatibility Practice and Applications 4 (3): 83-87