キーワード:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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2018,
Zhang K, Du L, Zhu Z, Song B, Xu D
IEEE Trans Electromagn Compat 60 (4): 829 - 839
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2020,
Zhang W, Song G, Zhao Q, Qi X
2020 6th Global Electromagnetic Compatibility Conference (GEMCCON), XI'AN, China. IEEE: 1-4; ISBN 978-1-7281-8464-7
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IEEE Trans Electromagn Compat 62 (4): 1443-1450
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2024,
Zhekov SS, Yao M, Di Paola C, Xu B, Zhang S
IEEE Trans Electromagn Compat 66 (1): 61-69
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2020,
Zheng J, Wang Z, Wang Q, Hu S, Gu Z, Kainz W, Chen J
IEEE Trans Electromagn Compat 62 (6): 2689-2695
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2020,
Zheng J, Lan Q, Zhang X, Kainz W, Chen J
IEEE Trans Electromagn Compat 62 (3): 673-681
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2024,
Zhou C, Snyder DP, Epstein B, Robinson ZT, Jin GY, Tang PY, Polcawich RG, Roper M
IEEE Trans Electromagn Compat [in press]
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2022,
Zhou C, Synder DP, Epstein B, Robinson ZT, Jin GY, Tang PY, Polcawich RG, Roper M
2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Spokane, WA, USA. IEEE: 439-442; ISBN 978-1-6654-0930-8
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2023,
Zhou X, Dou L, Huang H, Shen Q, Zhou X, Li A, Tang W, Pang X, Zhang Y, Wu T
2023 IEEE 7th International Symposium on Electromagnetic Compatibility (ISEMC), Hangzhou, China. IEEE: 1-5; ISBN 9798350333114
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2019,
Zhou Y, Zhang W, Yu H
Zhongguo Yi Liao Qi Xie Za Zhi 43 (2): 94-98