キーワード:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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J Egypt Soc Parasitol 38 (3): 945-956
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German Commission for Electrical, Electronic & Information Technologies of DIN and VDE (DKE),
DIN EN IEC 61980-1:2021-09 VDE 0122-10-1:2021-09
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Dokument Nr. R1174712004: 1-63
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2006,
Sorri MJ, Piiparinen PJ, Huttunen KH, Haho MJ
IEEE Trans Neural Syst Rehabil Eng 14 (1): 101-108
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2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Barcelona, Spain. IEEE: pp. 82-87; ISBN 978-1-7281-0595-6
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2024,
Vivarelli C, Censi F, Calcagnini G, Falsaperla R, Mattei E
Health Phys 127 (2): 269-275
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2021,
De Miguel-Bilbao S, Hernandez JA, Suarez OJ, Marina P, Febles VM, Rabassa LE, Suarez S, Karpowicz J, Zradzinski P, Gryz K, Aguirre E, Ramos V
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, Raleigh, NC, USA. IEEE: pp. 13-18; ISBN 978-1-6654-4889-5
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2021,
Cruciani S, Campi T, Maradei F, Feliziani M
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, Raleigh, NC, USA. IEEE: pp. 381-385; ISBN 978-1-6654-4889-5
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2021,
Sârbu A, Miclăuș S, Șorecău E, Bechet P
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, Raleigh, NC, USA. IEEE: pp. 243-248; ISBN 978-1-6654-4889-5
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2021,
Yang X, Zheng J, Chen J
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, Raleigh, NC, USA. IEEE: pp. 703-706; ISBN 978-1-6654-4889-5
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2021,
Yang W, Chen Q, Xu H, Li Y, Liang W, Dawalibi FP
2021 4th International Conference on Energy, Electrical and Power Engineering (CEEPE), Chongqing, China. IEEE: pp. 599-604; ISBN 978-1-6654-3364-8
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2020,
Das M, Jeunink S, Vogt-Ardatjew R, Van den Berg B, Leferink F
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: pp. 1-6; ISBN 978-1-7281-5580-7
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2019,
Cruciani S, Campi T, Maradei F, Feliziani M
2019 IEEE PELS Workshop on Emerging Technologies: Wireless Power Transfer (WoW), London, United Kingdom. IEEE: pp. 173-176; ISBN 978-1-7281-0881-0
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2017,
Dürrenberger G, Leuchtmann P, Röösli M, Siegrist M, Sütterlin B
Swiss Federal Office of Energy (SFOE),
1-125
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2016,
Dürrenberger G, Leuchtmann P, Röösli M, Siegrist M, Sütterlin B
Swiss Federal Office of Energy (SFOE),
Statusbericht 2016: 1-113
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2015,
Cruciani S, Campi T, Feliziani M, Maradei F
2015 IEEE International Symposium on Electromagnetic Compatibility (EMC), Dresden, Germany. IEEE: pp. 720-725; ISBN 978-1-4799-6615-8
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2015,
Armstrong R, Dawson L, Rowell AJ, Marshman CA, Ruddle AR
2015 IEEE International Symposium on Electromagnetic Compatibility (EMC), Dresden, Germany. IEEE: pp. 662-667; ISBN 978-1-4799-6615-8
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Health Estate 60 (1): 37-8, 40-2
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2003,
Malaric K, Bartolic J
Turk J Elec Eng & Comp Sci 11 (2): 143-154
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2024,
Campi T, Cruciani S, Maradei F, Feliziani M
IEEE Access 12: 109750-109758
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2024,
Di Capua G, Maffucci A, Capriglione D, Di Mambro G, Femia N, Oliva N, De Guglielmo L
2024 IEEE International Symposium on Measurements & Networking (M&N), Rome, Italy. IEEE: pp. 1-6; ISBN 9798350370546
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2024,
Ali Hamed SM, Alsaif H
IEEE Access 12: 89353-89362
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2024,
Vivarelli C, Censi F, Calcagnini G, Freschi F, Giaccone L, Canova A, Mattei E
IEEE Trans Electromagn Compat 66 (1): 97-107
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2024,
Xu Z, Rodriguez-Villegas E
IEEE Trans Biomed Circuits Syst 18 (2): 460-473
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2023,
Gutiérrez-Martínez J, Toledo-Peral CL, Vega-Martínez G, Mercado-Gutiérrez JA
2023 Global Medical Engineering Physics Exchanges/Pacific Health Care Engineering (GMEPE/PAHCE), Songdo, Korea, Republic of. IEEE: pp. 1-6; ISBN 9798350304015
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2022,
Beard BB, Iacono MI, Guag JW, Liu Y
IEEE Electromagn Compat Mag 11 (3): 49-54
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2022,
Sassi O, Kadi M, Niederholz M
IEEE Trans Electromagn Compat 64 (1): 139-149
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2021 17th Conference on Electrical Machines, Drives and Power Systems (ELMA), Sofia, Bulgaria. IEEE: pp. 1-4; ISBN 978-1-6654-1186-8
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2020,
Bejenaru O, Lazarescu C, Ursachianu MV, Salceanu A
2020 International Conference and Exposition on Electrical And Power Engineering (EPE), Iasi, Romania. IEEE: pp. 322-326; ISBN 978-1-7281-8127-1
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2020,
Azaro R, Gandolfo A
IEEE Trans Electromagn Compat 62 (4): 1611-1618
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2020,
Wu J, Qi Y, Gong G, Fan J, Miao M, Yu W, Ma J, Drewniak JL
IEEE Trans Electromagn Compat 62 (6): 2604-2612
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2019,
Ruddle AR, Martin AJM
IEEE Electromagn Compat Mag 8 (3): 75-85
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2019,
Le DT, Li K, Watanabe S, Onishi T
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 78-81; ISBN 978-1-7281-1639-6
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2019,
Bieth F, Delmote P, Schneider M
IEEE Trans Plasma Sci 47 (6): 2987-2994
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2019,
Sekiba Y, Yamazaki K
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 83-86; ISBN 978-1-7281-1639-6
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2019,
Gomez-Tames J, Rashed E, Hirata A, Tarnaud T, Tanghe E, Van de Steene T, Martens L, Joseph W
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 162-165; ISBN 978-1-7281-1639-6
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2019,
Sasaki K, Li K, Wake K, Watanabe S, Higashiyama J, Onishi T
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 43-46; ISBN 978-1-7281-1639-6
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2019,
Shiina T, Yamazaki K
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 744-747; ISBN 978-1-7281-1639-6
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2019,
Kageyama I, Masuda H, Morimatsu Y, Ishitake T, Sakakibara K, Hikage T, Hirata A
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 766-769; ISBN 978-1-7281-1639-6
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2019,
He Y, Leung PSW, Chow Y, Diao Y
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 750-753; ISBN 978-1-7281-1639-6
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2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 691-694; ISBN 978-1-7281-1639-6
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2019,
Feng Z, Diao Y, Sun W, He Y, Leung PSW
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 48-51; ISBN 978-1-7281-1639-6
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2019,
Laakso I, Lehtinen T
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 334-337; ISBN 978-1-7281-1639-6
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2019 11th International Symposium on Advanced Topics in Electrical Engineering (ATEE), Bucharest, Romania. IEEE: pp. 1-5; ISBN 978-1-7281-0102-6
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2018,
Monti G, Masotti D, Paolini G, Corchia L, Costanzo A, Dionigi M, Mastri F, Mongiardo M, Sorrentino R, Tarricone L
IEEE Electromagn Compat Mag 7 (1): 67-77
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2018,
Mengjun W, Jun Z, Hongxing Z, Mengjun W, Lulu C, Ze Y, Ping M, Hongxing Z
2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore. IEEE: pp. 981-985; ISBN 978-1-5090-3955-5
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2018,
Zeng X, Ma H, Pi C, Yang P, Yan S, Yuan S, Shi J, Zhang Y, Ma L, Pang S
2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore. IEEE: pp. 24-27; ISBN 978-1-5090-3955-5
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2018,
Ardeleanu ME, Nicoleanu P, Stanescu DG, Pisleag D
2018 International Conference on Applied and Theoretical Electricity (ICATE), Craiova, Romania. IEEE: pp. 1-6; ISBN 978-1-5386-3807-1
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2018,
Feliziani M, Campi T, Cruciani S, De Santis V
2018 International Symposium on Electromagnetic Compatibility (EMC EUROPE), Amsterdam, Netherlands. IEEE: pp. 155-160; ISBN 978-1-4673-9699-8
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2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore. IEEE: pp. 959-962; ISBN 978-1-5090-3955-5