キーワード:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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IEEE Trans Electromagn Compat 53 (3): 619 - 627
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2011,
Pignari SA, Spadacini G, Fedeli E
IEEE Trans Electromagn Compat 53 (3): 638-644
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International Organization for Standardization (ISO), International Electrotechnical Commission (IEC),
ISO/IEC TR 20017:2011: 1-56
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2011,
Gosselin MC, Vermeeren G, Kuhn S, Kellerman V, Benkler S, Uusitupa TMI, Joseph W, Gati A, Wiart J, Meyer FJC, Martens L, Nojima T, Hikage T, Balzano Q, Christ A, Kuster N
IEEE Trans Electromagn Compat 53 (4): 909-922
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2011,
Barbiroli M, Carciofi C, Guiducci D
IEEE Trans Electromagn Compat 53 (1): 219-228
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2011,
Piuzzi G, Bernardi P, Cavagnaro M, Pisa S, Lin JC
IEEE Trans Electromagn Compat 53 (1): 38-47
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2011,
Conil E, Hadjem A, Gati A, Wong MF, Wiart J
IEEE Trans Electromagn Compat 53 (1): 48-52
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2011,
De Santis V, Beeckman PA, Lampasi DA, Feliziani M
IEEE Trans Biomed Eng 58 (2): 390-396
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2010 Asia-Pacific International Symposium on Electromagnetic Compatibility, Beijing, China. IEEE: pp. 9-12; ISBN 978-1-4244-5622-2
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German Commission for Electrical, Electronic & Information Technologies of DIN and VDE (DKE),
DIN EN 60601-1-2 VDE 0750-1-2 Berichtigung 1:2010-05