キーワード:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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2022,
Budnarowska M, Mizeraczyk J, Bisewski D
Prz Elektrotechniczny 98 (2): 110-113
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2022,
Liu J, Wang Y, Guo R, Wang Q, Zheng J, Kurpad K, Kainz W, Chen J
IEEE Trans Electromagn Compat 64 (2): 286-294
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2022,
Lan J, Diao Y, Duan X, Hirata A
IEEE Trans Electromagn Compat 64 (2): 551-558
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2022,
Sassi O, Kadi M, Niederholz M
IEEE Trans Electromagn Compat 64 (1): 139-149
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2022,
Narusue Y, Morikawa H
IEEE Trans Magn 58 (2): 1-5
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Institute of Electrical and Electronics Engineers (IEEE),
IEEE Std 149-2021: 1-207, ISBN 978-1-5044-8017-8
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2021,
Kwon D, Lee YS, Lee AK, Choi HD
IEEE Trans Electromagn Compat 63 (2): 384-389
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2021,
Ruddle AR, Martin AJM, Emery M
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, Raleigh, NC, USA. IEEE: 1-6; ISBN 978-1-6654-4889-5
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2021,
Yang C, Schierholz M, Trunczik E, Helmich LM, Brüns HD, Schuster C
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, Raleigh, NC, USA. IEEE: 697-702; ISBN 978-1-6654-4889-5
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German Commission for Electrical, Electronic & Information Technologies of DIN and VDE (DKE),
DIN EN IEC 61980-1:2021-09 VDE 0122-10-1:2021-09