キーワード:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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2021,
Evangelista J, Loschi H, Costa ET, Smolenski R, Moonen N, Vogt-Ardatjew R
2021 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Nusa Dua - Bali, Indonesia. IEEE: pp. 1-4; ISBN 978-1-7281-7622-2
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2021,
Ardiatna W, Nugroho HW, Hidayat SW, Sukma I, Supono I, Mandaris D
2021 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Nusa Dua - Bali, Indonesia. IEEE: pp. 1-4; ISBN 978-1-7281-7622-2
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2021,
Diao Y, Li K, Sasaki K, Kodera S, Laakso I, El Hajj W, Hirata A
IEEE Trans Electromagn Compat 63 (5): 1709-1716
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2021,
De Miguel-Bilbao S, Hernandez JA, Suarez OJ, Marina P, Febles VM, Rabassa LE, Suarez S, Karpowicz J, Zradzinski P, Gryz K, Aguirre E, Ramos V
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, Raleigh, NC, USA. IEEE: pp. 13-18; ISBN 978-1-6654-4889-5
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2021,
Cruciani S, Campi T, Maradei F, Feliziani M
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, Raleigh, NC, USA. IEEE: pp. 381-385; ISBN 978-1-6654-4889-5
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2021,
Svistunou A, Mordachev V, Sinkevich E, Ye M, Dubovik A
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, Raleigh, NC, USA. IEEE: pp. 214-219; ISBN 978-1-6654-4889-5
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2021,
Sârbu A, Miclăuș S, Șorecău E, Bechet P
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, Raleigh, NC, USA. IEEE: pp. 243-248; ISBN 978-1-6654-4889-5
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2021,
Yang X, Zheng J, Chen J
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, Raleigh, NC, USA. IEEE: pp. 703-706; ISBN 978-1-6654-4889-5
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2021,
Andersen E, Casados C, Truong BD, Roundy S
IEEE Trans Electromagn Compat 63 (5): 1735-1747
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2021,
Hirata A, Diao Y, Onishi T, Sasaki K, Ahn S, Colombi D, De Santis V, Laakso I, Giaccone L, Joseph W, Rashed EA, Kainz W, Chen J
IEEE Trans Electromagn Compat 63 (5): 1619-1630
