キーワード:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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2021,
Yang W, Chen Q, Xu H, Li Y, Liang W, Dawalibi FP
2021 4th International Conference on Energy, Electrical and Power Engineering (CEEPE), Chongqing, China. IEEE: pp. 599-604; ISBN 978-1-6654-3364-8
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2021,
Seidman SJ, Bassen HI
Biomed Instrum Technol 55 (3): 91-95
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2021,
Xu B, Colombi D, Törnevik C, Ghasemifard F, Chen J
IEEE Trans Electromagn Compat 63 (5): 1680-1689
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2021,
Kaschel H, Ahumada C, Osorio-Comparan R
2021 IEEE International Conference on Automation/XXIV Congress of the Chilean Association of Automatic Control (ICA-ACCA), Valparaíso, Chile. IEEE: pp. 1-6; ISBN 978-1-6654-2978-8
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2021,
Mohd Baharin RH, Omi S, Uno T, Arima T
IEEE Trans Electromagn Compat 63 (5): 1658-1666
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2021,
Matsuzawa S-i, Kojima T, Mizuno K, Kagawa K, Wakamatsu A
IEEE Trans Electromagn Compat 63 (6): 1896-1903
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2021,
Campi T, Cruciani S, Maradei F, Feliziani M
IEEE Trans Electromagn Compat 63 (5): 1726-1734
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2021,
Shiina T, Kudo T, Herai D, Kuranari Y, Sekiba Y, Yamazaki K
IEEE Trans Electromagn Compat 63 (6): 1812-1819
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IEEE Trans Electromagn Compat 63 (5): 1690-1698
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2021,
Lottner T, Reiss S, Bitzer A, Bock M, Özen AC
IEEE Trans Electromagn Compat 63 (3): 662-672