キーワード:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
-
IEEE Trans Electromagn Compat 62 (2): 338-345
-
2019,
Wu I, Matsumoto Y, Gotoh K, Wake K, Watanabe S
2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Barcelona, Spain. IEEE: pp. 169-172; ISBN 978-1-7281-0595-6
-
2019,
Ruddle AR, Martin AJM
IEEE Electromagn Compat Mag 8 (3): 75-85
-
2019,
Le DT, Li K, Watanabe S, Onishi T
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 78-81; ISBN 978-1-7281-1639-6
-
2019,
Hussien HI, Ayob MA, Warsito IF, Supriyanto E, Reihannisha I
2019 International Conference on Technologies and Policies in Electric Power & Energy, Yogyakarta, Indonesia. IEEE: pp. 1-4; ISBN 978-1-7281-5693-4
-
2019,
Bieth F, Delmote P, Schneider M
IEEE Trans Plasma Sci 47 (6): 2987-2994
-
2019,
Liu J, Zheng J, Zeng Q, Wang Q, Rondoni J, Olsen J, Kainz W, Chen J
IEEE Trans Electromagn Compat 61 (4): 1091-1097
-
2019,
Virjoghe EO, Bancuta I, Husu AG, Cazacu D, Florescu V
J Sci Arts No.1 (46): 249-259
-
2019,
Zeng Q, Liu J, Angelone LM, Lloyd T, Wedan S, Chen J, Kainz W
IEEE Trans Electromagn Compat 61 (5): 1423-1431
-
2019,
Botsa VR, Kumar Munaka S, Dushyanth M, Bandaru S
2019 IEEE 5th Global Electromagnetic Compatibility Conference (GEMCCON), Bangalore, India. IEEE: pp. 1-4; ISBN 978-1-7281-4153-4