キーワード:
"elektromagnetische Verträglichkeit", EMC, EMV, "electromagnetic compatibility", 電磁両立性
-
Electronics 12 (23): 4780
-
2023,
Xu Z, Rodriguez-Villegas E
IEEE Trans Biomed Circuits Syst [in press]
-
2023,
Wu J, Ye J, Zou J, Gao J, Cui K
IEEE Access 11: 134191-134198
-
2023,
Giurgiuman A, Gliga M, Bojita A, Andreica S, Munteanu C, Topa V, Constantinescu C, Pacurar C
Technologies 11 (6): 159
-
IEEE Trans Electromagn Compat [in press]
-
2023,
Bastian GG, Pinto Nunes T, Quílez M, Fernández-Chimeno M, Silva F
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland. IEEE: 1-6; ISBN 9798350324013
-
2023,
Karpowicz J, Gryz K, Zradziński P
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland. IEEE: 1-5; ISBN 9798350324013
-
2023,
Voicu V, Dina LA, Dumbrava I, Mircea PM, Fieraru I
[電磁界の測定についての実験]
[tech./dosim.]
2023 International Conference on Electromechanical and Energy Systems (SIELMEN), Craiova, Romania. IEEE: 1-6; ISBN 9798350315257
-
2023,
Vivarelli C, Censi F, Calcagnini G, Mattei E
2023 53rd European Microwave Conference (EuMC), Berlin, Germany. IEEE: 263-266; ISBN 9798350347395
-
2023,
Nazemi M, Dommerque R, Daniel S
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland. IEEE: 1-6; ISBN 9798350324013