キーワード:
"elektromagnetische Verträglichkeit", EMC, EMV, "electromagnetic compatibility", 電磁両立性
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2023,
Voicu V, Dina LA, Dumbrava I, Mircea PM, Fieraru I
[電磁界の測定についての実験]
[tech./dosim.]
2023 International Conference on Electromechanical and Energy Systems (SIELMEN), Craiova, Romania. IEEE: 1-6; ISBN 9798350315257
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2023,
Vivarelli C, Censi F, Calcagnini G, Mattei E
2023 53rd European Microwave Conference (EuMC), Berlin, Germany. IEEE: 263-266; ISBN 9798350347395
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2023,
Nazemi M, Dommerque R, Daniel S
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland. IEEE: 1-6; ISBN 9798350324013
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2023,
Yamaguchi-Sekino S, Ikuyo M, Kamegai K, Taki M, Onishi T, Watanabe S
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland. IEEE: 1-6; ISBN 9798350324013
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2023,
Gryz K, Karpowicz J, Zradziński P
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland. IEEE: 1-5; ISBN 9798350324013
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2023,
Ramos V, Suárez SD, Marina P, Febles VM, Rabassa LE, Hernández JA
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland. IEEE: 1-6; ISBN 9798350324013
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2023,
Campi T, Cecilia V, Mattei E, Boumerdassi W, Rotellini M, Tatangelo G, Feliziani M
2023 XXXVth General Assembly and Scientific Symposium of the International Union of Radio Science (URSI GASS), Sapporo, Japan. IEEE: 1-4; ISBN 9798350309973
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2023,
Parsa N, Sanphuang V
2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI), Grand Rapids, MI, USA. IEEE: 655; ISBN 9798350309775
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2023,
Boukabou I, Rupanetti D, Kaabouch N, Foust L
2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI), Grand Rapids, MI, USA. IEEE: 413-418; ISBN 9798350309775
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2023,
Asadi R, Aliakbarian H, Sahraei A, Yazdani R, Kim DH
2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI), Grand Rapids, MI, USA. IEEE: 608-613; ISBN 9798350309775