キーワード:
"elektromagnetische Verträglichkeit", EMC, EMV, "electromagnetic compatibility", 電磁両立性
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2024,
Yang X, Guo R, Zheng J, Chen X, Chen J
IEEE Trans Electromagn Compat [in press]
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2024,
Dianovský R, Pecho P, Hrúz M, Velký P
2024 New Trends in Civil Aviation (NTCA), Prague, Czech Republic. IEEE: 133-139; ISBN 9798350317961
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2024,
Yao A, Pei Y, He J, Wang J, Yang P
IEEE Trans Electromagn Compat 66 (2): 405-416
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2024,
Woo S, Shin Y, Lee C, Moon J, Kim H, Kim H, Huh S, Ahn S
IEEE Trans Electromagn Compat [in press]
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2024,
Yao M, Pedersen GF, Zhang S
IEEE Trans Electromagn Compat [in press]
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2024,
Vivarelli C, Censi F, Calcagnini G, Falsaperla R, Mattei E
Health Phys [in press]
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2024,
Zhou C, Snyder DP, Epstein B, Robinson ZT, Jin GY, Tang PY, Polcawich RG, Roper M
IEEE Trans Electromagn Compat [in press]
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Energies 17 (1): 126
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2024,
Quercio M, Lozito GM, Corti F, Riganti Fulginei F, Laudani A
IEEE Access 12: 16728-16740
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2024,
Sufian MA, Hussain N
IEEE Trans Electromagn Compat 66 (2): 417-426
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2024,
Vivarelli C, Censi F, Calcagnini G, Freschi F, Giaccone L, Canova A, Mattei E
IEEE Trans Electromagn Compat 66 (1): 97-107
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2024,
Xu Z, Rodriguez-Villegas E
IEEE Trans Biomed Circuits Syst 18 (2): 460-473
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IEEE Trans Electromagn Compat 66 (2): 392-404
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2024,
David A, Tiemann M, Haussmann N, Stroka S, Clemens M, Schmuelling B
IEEE Ind Appl Mag 30 (1): 59-67
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2024,
Zhekov SS, Yao M, Di Paola C, Xu B, Zhang S
IEEE Trans Electromagn Compat 66 (1): 61-69
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2024,
Ardeshirpour Y, Cohen ED, Seidman SJ, Taddese B, Zaidi T, Bassen H
Bioelectromagnetics 45 (2): 70-81
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2023,
Rhee J, Ahn J, Kim H, Lee C, Ahn S
2023 XXXVth General Assembly and Scientific Symposium of the International Union of Radio Science (URSI GASS), Sapporo, Japan. IEEE: 1-4; ISBN 9798350309973
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2023,
Gutiérrez-Martínez J, Toledo-Peral CL, Vega-Martínez G, Mercado-Gutiérrez JA
2023 Global Medical Engineering Physics Exchanges/Pacific Health Care Engineering (GMEPE/PAHCE), Songdo, Korea, Republic of. IEEE: 1-6; ISBN 9798350304015
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2023,
Vélez RS, van Helvoort MJAM, Vogt-Ardatjew R, Van den Berg B, Leferink F
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland. IEEE: 1-6; ISBN 9798350324013
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2023,
Zhou X, Dou L, Huang H, Shen Q, Zhou X, Li A, Tang W, Pang X, Zhang Y, Wu T
2023 IEEE 7th International Symposium on Electromagnetic Compatibility (ISEMC), Hangzhou, China. IEEE: 1-5; ISBN 9798350333114
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2023,
Xinhua P, Xin Z, Huixiong H, Qingfei S, Anxiang L, Wei T, Chao Y, Tong W
2023 IEEE 7th International Symposium on Electromagnetic Compatibility (ISEMC), Hangzhou, China. IEEE: 1-5; ISBN 9798350333114
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2023 IEEE 7th International Symposium on Electromagnetic Compatibility (ISEMC), Hangzhou, China. IEEE: 1-4; ISBN 9798350333114
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2023,
Li C, Sha S, Zhao H, Xing L, Xu Q
2023 IEEE 7th International Symposium on Electromagnetic Compatibility (ISEMC), Hangzhou, China. IEEE: 1-3; ISBN 9798350333114
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Electronics 12 (23): 4780
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2023,
Wu J, Ye J, Zou J, Gao J, Cui K
IEEE Access 11: 134191-134198