キーワード:
"elektromagnetische Verträglichkeit", EMC, EMV, "electromagnetic compatibility", 電磁両立性
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2025,
Mustapha AA, Gaya S, Hassan OS, Abou-Khousa MA
Measurement 242 Pt D: 116134
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2025,
Karnas G, Maslowski G
IEEE Trans Electromagn Compat 67 (1): 217-226
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2025,
Kodera S, Kimura S, Uehara S, Yuasa A, Ushizawa K, Otaka Y, Hirata A
IEEE Trans Electromagn Compat 67 (2): 418-426
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2025,
Anjitha V, Sunitha K
IEEE Trans Electromagn Compat 67 (1): 72-81
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IEEE Trans Electromagn Compat 67 (2): 403-417
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2024,
Senapati RK, Tanna PJ, Shrivastava A
2024 IEEE 2nd International Conference on Innovations in High Speed Communication and Signal Processing (IHCSP), Bhopal, India. IEEE: pp. 1-6; ISBN 9798350368956
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2024 2nd China Power Supply Society Electromagnetic Compatibility Conference (CPEMC), Hangzhou, China. IEEE: pp. 104-109; ISBN 9798331509569
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2024,
Senevirathna N, Kleihorst R
2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa), Ginowan, Okinawa, Japan. IEEE, Japan: pp. 100-103; ISBN 9798350349498
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2024,
Aciu LE, Ghiță-Pîrnuță OA, Ogrutan PL
TEM J 13 (4): 3250-3258
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2024,
Hammen L, Pichon L, Le Bihan Y, Bensetti M, Fleury G
CR physique 25 (S1): 75-86