キーワード:
奇形, Fehlbildung, Missbildung, Dysgenesie, malformation, abnormality, dysgenesis, 異常
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2024 21st International Conference on Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology (ECTI-CON), Khon Kaen, Thailand. IEEE: pp. 1-6; ISBN 9798350381566
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2024,
Indhumathi K, Jeyarani SS, Shalini S
2024 5th International Conference on Intelligent Communication Technologies and Virtual Mobile Networks (ICICV), Tirunelveli, India. IEEE: pp. 618-626; ISBN 9798350385656
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2023,
Liu L, Liao M, Jia L, Li B, Wan W
2023 2nd International Conference on Power Electronics and Electrical Technology, Chongqing, China. Journal of Physics: Conference Series, 2656巻; IOP Publishing: p. 012013; ISBN 978-1-7138-8535-1
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2023,
Babu MA, Mohapatra SK, Ahmmed MM, Arif AS, Sarker MM, Mohanty J
2023 14th International Conference on Computing Communication and Networking Technologies (ICCCNT), Delhi, India. IEEE: pp. 1-4; ISBN 9798350335101
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2023,
Killian O, Hutchinson M, Reilly R
Shaikh A, Sadnicka A (eds.): Basic and Translational Applications of the Network Theory for Dystonia. Advances in Neurobiology, 31巻; Springer, Cham; pp. 177-194; ISBN 978-3-031-26219-7
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2023,
Frey J, Ramirez-Zamora A, Wagle Shukla A
Shaikh A, Sadnicka A (eds.): Basic and Translational Applications of the Network Theory for Dystonia. Advances in Neurobiology, 31巻; Springer, Cham; pp. 119-139; ISBN 978-3-031-26219-7
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2022,
Al-Dulamey QK, Hassoon Oraibi A, Al-Salihi A
2022 2nd International Conference on Advances in Engineering Science and Technology (AEST), Babil, Iraq. IEEE: pp. 23-28; ISBN 9798350334913
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2022,
Jahan I, Noman OF, Kabir A
2022 4th International Conference on Sustainable Technologies for Industry 4.0 (STI), Dhaka, Bangladesh. IEEE: pp. 1-6; ISBN 978-1-6654-9046-7
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2022,
Asha Banu SM, Niresh Kumar K, Mohamed Faizal M, Murugananda Sri Sabari Vasan S
2022 4th International Conference on Inventive Research in Computing Applications (ICIRCA), Coimbatore, India. IEEE: pp. 1-8; ISBN 978-1-6654-9708-4
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2022 International Conference on Engineering & MIS (ICEMIS), Istanbul, Turkey. IEEE: pp. 1-4; ISBN 978-1-6654-5437-7