キーワード:
磁気共鳴画像法, Kernspinresonanztomographie, Magnetresonanztomographie, Kernspintomographie, MRI, MRT, NMR, "magnetic resonance imaging"
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2021,
Guo R, Zheng J, Xia M, Jiang G, Shrivastava D, Kainz W, Chen J
2021 43rd Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC), Mexico. IEEE: 1527-1530; ISBN 978-1-7281-1179-7
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2021,
Zheng C, Chen X, Nguyen BT, Sanpitak P, Vu J, Bagci U, Golestanirad L
2021 43rd Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC), Mexico. IEEE: 4204-4208; ISBN 978-1-7281-1179-7
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2021,
Nguyen BT, Bhusal B, Fawcett K, Golestanirad L
2021 43rd Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC), Mexico. IEEE: 4986-4989; ISBN 978-1-7281-1179-7
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2021,
Yang X, Zheng J, Chen J
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, Raleigh, NC, USA. IEEE: 703-706; ISBN 978-1-6654-4889-5
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2021,
Jeschke P, Alteköster C, Bömmels I, Jagielski K, Becker C, Hoffmann M
2021 XXXIVth General Assembly and Scientific Symposium of the International Union of Radio Science (URSI GASS), Rome, Italy. IEEE: 1-3; ISBN 978-1-6654-2995-5
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2021,
Zhang C, Li C, Wu T
2021 XXXIVth General Assembly and Scientific Symposium of the International Union of Radio Science (URSI GASS), Rome, Italy. IEEE: 1-4; ISBN 978-1-6654-2995-5
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2021,
Arduino A, Bottauscio O, Zilberti L
2021 XXXIVth General Assembly and Scientific Symposium of the International Union of Radio Science (URSI GASS), Rome, Italy. IEEE: 1-4; ISBN 978-1-6654-2995-5
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2021,
Zumbo S, Bevacqua MT, Isernia T
2021 XXXIVth General Assembly and Scientific Symposium of the International Union of Radio Science (URSI GASS), Rome, Italy. IEEE: 1-5; ISBN 978-1-6654-2995-5
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2021,
Golestanirad L, Pilitsis J
2021 International Conference on Electromagnetics in Advanced Applications (ICEAA), Honolulu, HI, USA. IEEE: 343; ISBN 978-1-6654-1387-9
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2021,
Klein V, Davids M, Schad LR, Wald LL, Guérin B
2021 International Conference on Electromagnetics in Advanced Applications (ICEAA), Honolulu, HI, USA. IEEE: 215; ISBN 978-1-6654-1387-9