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2018 International Conference and Exposition on Electrical And Power Engineering (EPE), Iasi, Romania. IEEE: 693-696; ISBN 978-1-5386-5063-9
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2018,
Gonos J, Kladas A, Labridis D, Mikropoulos P, Koulouridis S, Pyrgioti E, Kyriacou G, Safigianni A
2018 IEEE International Conference on Environment and Electrical Engineering and 2018 IEEE Industrial and Commercial Power Systems Europe (EEEIC / I&CPS Europe), Palermo, Italy. IEEE: 1-5; ISBN 978-1-5386-5187-2
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2018,
Silva AAR, Silva LB, Silva RM, Dias RBB
Arezes PM, Baptista JS, Barroso MP, Carneiro P, Cordeiro P, Costa N, Melo RB, Miguel AS, Perestrelo G (eds.): Occupational Safety and Hygiene VI: Book Chapters from the 6th International Symposium on Occupation Safety and Hygiene (SHO 2018), March 26-27, 2018, Guimarães, Portugal. CRC Press/Balkema, Leiden, The Netherlands; 213-217; ISBN 978-1-138-54203-7
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2018,
Liorni I, Neufeld E, Kuehn S, Kuster N
2018 IEEE Wireless Power Transfer Conference (WPTC), Montreal, QC, Canada. IEEE: 1-3; ISBN 978-1-5386-5160-5
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2018,
Aumann HM, Emanetoglu NW
2018 40th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), Honolulu, HI, USA. IEEE: 5121-5124; ISBN 978-1-5386-3647-3
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Balas VE, Jain LC, Balas MM (eds.): Soft Computing Applications. SOFA 2016. Advances in Intelligent Systems and Computing, 633巻; Springer, Cham; 95-106; ISBN 978-3-319-62520-1
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2018,
Periyasamy M, Dhanasekaran R, Mahendran G
2018 International Conference on Communication and Signal Processing (ICCSP), Chennai, India. IEEE: 0911-0917; ISBN 978-1-5386-3522-3
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2018,
Liorni I, Capstick M, Kuehn S, Kuster N
2018 IEEE Wireless Power Transfer Conference (WPTC), Montreal, QC, Canada. IEEE: 1-4; ISBN 978-1-5386-5160-5
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2018,
Barabas J, Radil R, Janousek L, Kamencay P
2018 ELEKTRO, Mikulov, Czech Republic. IEEE: 1-4; ISBN 978-1-5386-4760-8
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2018,
Zeng X, Ma H, Pi C, Yang P, Yan S, Yuan S, Shi J, Zhang Y, Ma L, Pang S
2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore. IEEE: 24-27; ISBN 978-1-5090-3955-5