-
2023,
Eberhard J, Fröhlich J, Zahner M
Swiss Federal Office of Energy (SFOE),
1-63
-
2023,
Valentum Kommunikation GmbH
Federal Office for Radiation Protection (BfS),
Ressortforschungsberichte zum Strahlenschutz, BfS-RESFOR-209/23: 1-10
-
2023,
Hooli SS, Vadde A, Kadambi GR, Manickavasagam K
2023 International Conference on Power, Instrumentation, Energy and Control (PIECON), Aligarh, India. IEEE: 1-6; ISBN 9798350399776
-
2023,
Pavan G, Reddy VKRN, Prasad AR, Chintala RR, Sai NR
2023 7th International Conference on Computing Methodologies and Communication (ICCMC), Erode, India. IEEE: 949-953; ISBN 978-1-6654-6409-3
-
2023,
Gupta J, Das P, Bhowmik T, Bhattacharjee R, Sikdar D
2023 National Conference on Communications (NCC), Guwahati, India. IEEE: 1-4; ISBN 978-1-6654-5626-5
-
2023,
Falcão P, Peixeiro C
2023 International Microwave and Antenna Symposium (IMAS), Cairo, Egypt. IEEE: 139-141; ISBN 978-1-6654-9076-4
-
German Bundestag (Parliament of the Federal Republic of Germany),
Drucksache 20/5646: 1-312
-
Institute of Electrical and Electronics Engineers (IEEE),
IEEE Std C95.7-2022: 1-139, ISBN 978-1-5044-9390-1
-
International Electrotechnical Commission (IEC), Institute of Electrical and Electronics Engineers (IEEE),
IEEE/IEC P62209-3: 1-209
-
2023,
Deng ZD, Robins PL, Dannhauer M, Haugen LM, Port JD, Croarkin PE
medRxiv: the Preprint Server for Health Sciences (medRxiv),
2023.02.06.23285526: 1-18
-
2023,
Kakaraparty K, Mahbub I
2023 United States National Committee of URSI National Radio Science Meeting (USNC-URSI NRSM), Boulder, CO, USA. IEEE: 141-142; ISBN 978-1-6654-7642-3
-
2023,
Nandikanti A, Zheng J, Hu W, Chen J
2023 United States National Committee of URSI National Radio Science Meeting (USNC-URSI NRSM), Boulder, CO, USA. IEEE: 81-82; ISBN 978-1-6654-7642-3
-
2023,
Jamshed MA, Khan WU, Pervaiz H, Imran MA, Ur Rehman M
Ur Rehman M, Jamshed MA (eds.): Low Electromagnetic Field Exposure Wireless Devices: Fundamentals and Recent Advances. Wiley-IEEE Press; 213-224; ISBN 978-1-119-90916-3
-
2023,
Qureshi MRA, Alfadhl Y, Chen X
Ur Rehman M, Jamshed MA (eds.): Low Electromagnetic Field Exposure Wireless Devices: Fundamentals and Recent Advances. Wiley-IEEE Press; 49-75; ISBN 978-1-119-90916-3
-
2023,
Jamshed MA, Héliot F, Brown TWC
Ur Rehman M, Jamshed MA (eds.): Low Electromagnetic Field Exposure Wireless Devices: Fundamentals and Recent Advances. Wiley-IEEE Press; 187-211; ISBN 978-1-119-90916-3
-
2023,
Jamshed MA, Brown TWC, Héliot F
Ur Rehman M, Jamshed MA (eds.): Low Electromagnetic Field Exposure Wireless Devices: Fundamentals and Recent Advances. Wiley-IEEE Press; 115-134; ISBN 978-1-119-90916-3
-
Ur Rehman M, Jamshed MA (eds.): Low Electromagnetic Field Exposure Wireless Devices: Fundamentals and Recent Advances. Wiley-IEEE Press; 19-47; ISBN 978-1-119-90916-3
-
International Electrotechnical Commission (IEC), Institute of Electrical and Electronics Engineers (IEEE),
IEC/IEEE P63184: 1-130
-
2022,
Wane S, Dinh TV, Tran QH, Bajon D, Ferrero F, Duvillaret L, Gaborit G, Sombrin J, de Lédinghen E, Laban P, Huard V, Mhira S, Tombakdjian L, Ratajczak P, Bousseksou A
2022 IEEE Radio and Wireless Symposium (RWS), Las Vegas, NV, USA. IEEE: 68-71; ISBN 978-1-6654-3463-8
-
2022,
Caramazza L, Paffi A, Liberti M, Apollonio F
2021 51st European Microwave Conference (EuMC), London, United Kingdom. IEEE: 785-788; ISBN 978-1-6654-4721-8
-
2022 2nd Asian Conference on Innovation in Technology (ASIANCON), Ravet, India. IEEE: 1-5; ISBN 978-1-6654-6852-7
-
2022,
Sharma KK, Bindle A, Reshma
2022 International Conference on Computing, Communication and Power Technology (IC3P), Visakhapatnam, India. IEEE: 172-175; ISBN 978-1-6654-2526-1
-
2022,
Mittal V, Yaduvanshi RS
2022 2nd Asian Conference on Innovation in Technology (ASIANCON), Ravet, India. IEEE: 1-4; ISBN 978-1-6654-6852-7
-
2022 IEEE Wireless Antenna and Microwave Symposium (WAMS), Rourkela, India. IEEE: 1-4; ISBN 978-1-6654-5847-4
-
2022,
Gasperini D, Costa F, Daniel L, Manara G, Genovesi S
2022 Sixteenth International Congress on Artificial Materials for Novel Wave Phenomena (Metamaterials), Siena, Italy. IEEE: X-151-X-153; ISBN 978-1-6654-6585-4