-
2020,
Rumeng T, Ying S, Tong W, Wentao Z
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: 659-662; ISBN 978-1-7281-7431-0
-
2017,
Rumeng T, Senwen L, Tong W, Shaochuan C
2017 IEEE 5th International Symposium on Electromagnetic Compatibility (EMC-Beijing), Beijing, China. IEEE: 1-5; ISBN 978-1-5090-5186-1
-
2020,
Rumpf JJ, May L, Fricke C, Classen J, Hartwigsen G
Cereb Cortex 30 (3): 1030-1039
-
1975,
Rupp T, Montet J, Frazer JW
Ann N Y Acad Sci 247: 282-291
-
1994,
Ruppe I, Eggert S, Goltz S, Hentschel K
Federal Institute for Occupational Safety and Health and Occupational Medicine (BAuA),
Ergebnisbericht, 11.002: 1-84
-
2019,
Rushingabigwi G, Sun LG, Twizere C, Nsengiyumva P, Sibomana L, Gatare I, Ntawangaheza JD, He YX
2019 Photonics & Electromagnetics Research Symposium - Fall (PIERS - Fall), Xiamen, China. IEEE: 1971-1979; ISBN 978-1-7281-5305-6
-
2020,
Ruslan AA, Mohamad SY, Abdul Malek NF, Yusoff SH, Ibrahim SN, Mohd Isa FN
2020 IEEE Student Conference on Research and Development (SCOReD), Batu Pahat, Johor, Malaysia. IEEE: 1-5; ISBN 978-1-7281-9318-2
-
2008,
Rusnani A, Norhayati MN, Siti Noraini S, Marina M
2008 IEEE International RF and Microwave Conference, Kuala Lumpur, Malaysia. IEEE: 262-267; ISBN 978-1-4244-2867-0
-
Environ Res 165: 484-495
-
2004,
Russell MJ, Gaetz M
J Clin Monit Comput 18 (1): 25-32