Die folgenden Begriffe wurden einbezogen:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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2013,
Hikage T, Kawamura Y, Nojima T, Nagaoka T, Watanabe S
International Symposium on Electromagnetic Compatibility, Brugge, 2013. IEEE: 165-168; ISBN 978-1-4673-4980-2
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J Microw Power 18 (2): 181-195
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2009,
Hille S, Eichhorn KF, Gonschorek KH
2009 IEEE International Symposium on Electromagnetic Compatibility, Austin, TX, USA. IEEE: 147-152; ISBN 978-1-4244-4266-9
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2008,
Hille S, Eichhorn KF, Gonschorek KH
International Symposium on Electromagnetic Compatibility - EMC Europe, Hamburg, 2008. IEEE: 1-5; ISBN 978-1-4244-4097-9
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2021,
Hirata A, Diao Y, Onishi T, Sasaki K, Ahn S, Colombi D, De Santis V, Laakso I, Giaccone L, Joseph W, Rashed EA, Kainz W, Chen J
IEEE Trans Electromagn Compat 63 (5): 1619-1630
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2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: 1-5; ISBN 978-1-7281-5580-7
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2013,
Hirata A, Tsuchida S, Laaskso I
International Symposium on Electromagnetic Compatibility, Brugge, 2013. IEEE: 89-92; ISBN 978-1-4673-4980-2
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2010,
Hirata A, Fujiwara O, Nagaoka T, Watanabe S
IEEE Trans Electromagn Compat 52 (1): 41-48
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2007,
Hirata A, Nagaya Y, Fujiwara O, Nagaoka T, Watanabe S
2007 IEEE International Symposium on Electromagnetic Compatibility, Honolulu, HI, USA. IEEE: 1-4; ISBN 978-1-4244-1349-2
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2006,
Hirata A, Fujimoto M, Asano T, Jianqing Wang, Fujiwara O, Shiozawa T
IEEE Trans Electromagn Compat 48 (3): 569-578
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IEEE Trans Electromagn Compat 47 (1): 68-76
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2003,
Hirata A, Morita M, Shiozawa T
IEEE Trans Electromagn Compat 45 (1): 109-116
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2002,
Hirata A, Watanabe H, Shiozawa T
IEEE Trans Electromagn Compat 44 (4): 592-594
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2000,
Hirata A, Matsuyama SI, Shiozawa T
IEEE Trans Electromagn Compat 42 (4): 386-393
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2020,
Hong S, Jeong S, Lee S, Sim B, Kim H, Kim J
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: 623-625; ISBN 978-1-7281-7431-0
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IEEE Electromagn Compat Mag 9 (3): 96-99
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IEEE Electromagn Compat Mag 2 (4): 71
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1987 IEEE International Symposium on Electromagnetic Compatibility, Atlanta, GA, USA. IEEE: 501-504; ISBN 978-1-5090-3174-0
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2016,
Hou J, Xu T, Wang X, Yi P
Zhongguo Yi Liao Qi Xie Za Zhi 40 (4): 282-285
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2018,
Houran MA, Yang X, Chen W, Samizadeh M
2018 International Power Electronics Conference (IPEC-Niigata 2018 -ECCE Asia), Niigata, Japan. IEEE: 1062-1066; ISBN 978-1-5386-4190-3
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IEEE Electromagn Compat Mag 7 (1): 78-86
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2019,
Hussien HI, Ayob MA, Warsito IF, Supriyanto E, Reihannisha I
2019 International Conference on Technologies and Policies in Electric Power & Energy, Yogyakarta, Indonesia. IEEE: 1-4; ISBN 978-1-7281-5693-4
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2017,
Hwang JH, Kang TW, Kwon JH, Park SO
IEEE Trans Electromagn Compat 59 (1): 48-57
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2023,
Hwata C, Rushingabigwi G, Gatera O, Twizere C, Mukanyiligira D, Thomas BN
2023 Photonics & Electromagnetics Research Symposium (PIERS), Prague, Czech Republic. IEEE: 1389-1396; ISBN 9798350312850
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2017,
Il Kwak S, Sim DU, Kwon JH, Yoon YJ
IEEE Trans Electromagn Compat 59 (1): 297-300
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2007,
Ilvonen S, Sarvas J
IEEE Trans Electromagn Compat 49 (2): 294-301
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1970 IEEE Electromagnetic Compatibility Symposium Record, Anaheim, CA, USA. IEEE: 168-172; ISBN 978-1-5090-3156-6
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2020,
Ishida K, Wu I, Gototh K, Matsumoto Y
J Med Syst 44 (9): 154
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2016,
Ishida K, Fujioka T, Endo T, Hosokawa R, Fujisaki T, Yoshino R, Hirose M
J Med Syst 40 (3): 46
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2015,
Ishida T, Nitta S, Xiao F, Kami Y, Fujiwara O
2015 IEEE International Symposium on Electromagnetic Compatibility (EMC), Dresden, Germany. IEEE: 839-842; ISBN 978-1-4799-6615-8
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2018,
Isrie S, Moonen N, Schipper H, Bergsma H, Lefcrink F
2018 International Symposium on Electromagnetic Compatibility (EMC EUROPE), Amsterdam, Netherlands. IEEE: 500-505; ISBN 978-1-4673-9699-8
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2015,
Istanbullu OB, Akdogan G
[2015 Medical Technologies National Conference (TIPTEKNO), Bodrum, Turkey]. IEEE: 1-4; ISBN 978-1-4673-7765-2
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2021,
Jeong H, Ntolkeras G, Grant PE, Bonmassar G
IEEE Trans Electromagn Compat 63 (5): 1748-1756
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2019,
Ji X, Zheng J, Yang R, Kainz W, Chen J
IEEE Trans Electromagn Compat 61 (1): 57 - 64
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2023 IEEE 7th International Symposium on Electromagnetic Compatibility (ISEMC), Hangzhou, China. IEEE: 1-4; ISBN 9798350333114
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2005,
Jianqing W, Fujiwara O, Uda T
IEEE Trans Electromagn Compat 47 (4): 971-976
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2017,
Jin L, Peng C, Jiang T
IEEE Trans Electromagn Compat 59 (4): 1095-1102
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2015,
Jog SR, Paranjape PM
2015 International Conference on Energy Systems and Applications, Pune, India. IEEE: 706-711; ISBN 978-1-4673-6817-9
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2022,
Johansson M, Carlsson J
2022 International Symposium on Electromagnetic Compatibility – EMC Europe, Gothenburg, Sweden. IEEE: 137-140; ISBN 978-1-6654-0789-2
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2017,
Jomaa K, Ndagijimana F, Ayad H, Fadlallah M, Jomaah J
2017 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Angers. IEEE, Angers, France; ISBN 978-1-5386-0689-6
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2008,
Joseph W, Verloock L, Martens L
IEEE Trans Electromagn Compat 50 (3): 730-735
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2005,
Joseph W, Martens L
IEEE Trans Electromagn Compat 47 (4): 977-985
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2003,
Joseph W, Martens L
IEEE Trans Electromagn Compat 45 (2): 339-349
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2010,
Ju M, Yang K, Myung S
IEEE Trans Electromagn Compat 52 (4): 843-848
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2013,
Julstrom SD, Kozma-Spytek LK, Beard BB
IEEE Electromagn Compat Mag 2 (2): 69-81
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2019,
Kageyama I, Masuda H, Morimatsu Y, Ishitake T, Sakakibara K, Hikage T, Hirata A
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: 766-769; ISBN 978-1-7281-1639-6
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2005,
Kainz W, Casamento JP, Ruggera PS, Chan DD, Witters DM
IEEE Trans Biomed Eng 52 (3): 520-530
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2001,
Kainz W, Neubauer G, Alesch F, Schmid G, Jahn O
Wien Klin Wochenschr 113 (23-24): 903-914
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2020,
Kamimura Y, Daimon K, Matsumoto N, Kimura S, Sato K
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: 1-4; ISBN 978-1-7281-5580-7
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2018,
Kamimura Y, Inagaki S, Wake K
2018 International Symposium on Electromagnetic Compatibility (EMC EUROPE), Amsterdam, Netherlands. IEEE: 855-859; ISBN 978-1-4673-9699-8