Die folgenden Begriffe wurden einbezogen:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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2018,
Koh WJ, Moochhala SM
2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore. IEEE: 518-522; ISBN 978-1-5090-3955-5
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2016,
Luca C, Andriţoi D, Corciovă C, Ciorap R
2016 International Conference and Exposition on Electrical and Power Engineering (EPE), Iasi, Romania. IEEE; ISBN 978-1-5090-6130-3
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2015,
Pavlik M, Lisoň L, Kurimský P
Kolcun M, Kurimský J, Kolcunová I (Hrsg.): 8th International Scientific Symposium on Electrical Power Engineering (ELEKTROENERGETIKA 2015). Curran Associates, Inc., Red Hook, NY; 560-563; ISBN 978-1-5108-1142-3
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2015,
Bohmelt S, Scharf F, Dudzinski M, Rozgic M, Fichte LO, Stiemer M
2015 IEEE International Symposium on Electromagnetic Compatibility (EMC), Dresden, Germany. IEEE: 535-540; ISBN 978-1-4799-6615-8
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2011,
Calcagnini G, Mattei E, Censi F, Triventi M, Lo Sterzo R, Marchetta E, Bartolini P
Health Phys 100 (5): 497-501
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2010,
Zilberti L, Pons E, Bottauscio O, Chiampi M, Pastorelli M
IEEE Transactions on Power Delivery 25 (4): 3085-3094
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1997,
Watson DB, Sedcole NP, Chan E, Smart KG, Patel SM
IET 10th International Conference on (Conf. Publ. No. 445) Electromagnetic Compatibility, 1997. IET: 54-58
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1995,
Brinkmann K, Kärner HC, Schaefer H
VDE-Verlag; ISBN 978-3-8007-2106-1
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2023,
Vélez RS, van Helvoort MJAM, Vogt-Ardatjew R, Van den Berg B, Leferink F
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland. IEEE: 1-6; ISBN 9798350324013
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2021,
Svistunou A, Mordachev V, Sinkevich E, Ye M, Dubovik A
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, Raleigh, NC, USA. IEEE: 214-219; ISBN 978-1-6654-4889-5
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2019,
Shoaib N, Zaidi SNF, Shafqat A, Cheema HM
2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo), Hangzhou, China. IEEE: 210-212; ISBN 978-1-7281-4263-0
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2017,
Campi T, Cruciani S, De Santis V, Maradei F, Feliziani M
2017 International Conference of Electrical and Electronic Technologies for Automotive, Turin, Italy. IEEE: 1-4; ISBN 978-1-5090-6006-1
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2017,
Mishra SK, Chowdhary R, Kumari S, Rao SB
J Clin of Diagn Res 11 (5): ZE01-ZE05
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2016 IEEE/ACES International Conference on Wireless Information Technology and Systems (ICWITS) and Applied Computational Electromagnetics (ACES), Honolulu, HI, USA. IEEE: 1-4; ISBN 978-1-5090-1259-6
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2016,
Hou J, Xu T, Wang X, Yi P
Zhongguo Yi Liao Qi Xie Za Zhi 40 (4): 282-285
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Deutsche Kommission Elektrotechnik Elektronik Informationstechnik in DIN und VDE (DKE),
DIN EN 61786-1 VDE 0848-786-1:2014-10
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Verband der Elektrotechnik Elektronik Informationstechnik e.V. (VDE),
VDE-AR-E 2122-4-2:2011-03
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Herzschrittmacherther Elektrophysiol 15 (1): 3-8
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2021,
Seidman SJ, Bassen HI
Biomed Instrum Technol 55 (3): 91-95
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2019,
Škiljo M, Blažević Z, Poljak D
2019 International Conference on Software, Telecommunications and Computer Networks (SoftCOM), Split, Croatia. IEEE: 1-5; ISBN 978-1-7281-3711-7
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2018,
He W, Gao Z, Zhang W
Zhongguo Yi Liao Qi Xie Za Zhi 42 (5): 372-374
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2018,
Kurta E, Kovačević Ž, Gurbeta L, Badnjević A
2018 7th Mediterranean Conference on Embedded Computing (MECO), Budva, Montenegro. IEEE: 1-4; ISBN 978-1-5386-5684-6
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[Elektromagnetische Verträglichkeit in der Kfz-Technik: Beiträge der 7. GMM-Fachtagung, 2017]. VDE/VDI-Gesellschaft Mikroelektronik Mikrosystem- und Feinwerktechnik (GMM): 23-28; ISBN 978-3-8007-4460-2
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2017,
Bärenfänger J, Cuartielles D, Kürschner D, Maarleveld M
[Elektromagnetische Verträglichkeit in der Kfz-Technik: Beiträge der 7. GMM-Fachtagung, 2017]. VDE/VDI-Gesellschaft Mikroelektronik Mikrosystem- und Feinwerktechnik (GMM): 7-16; ISBN 978-3-8007-4460-2
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2016,
Salcedo JD, Pretorius VG, Hsu JC, Lalani GG, Schricker AA, Hebsur SM, McGARRY TJ, Hunter JA, Lewis KE, Krummen DE, Feld GK, Birgersdotter-Green U
Pacing Clin Electrophysiol 39 (11): 1254-1260
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Journal of the Chinese Institute of Engineers 38 (6): 760-769
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2014,
Theodoridis MP, Mollov SV
Biomed Tech 59 (5): 461-469
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2014,
Marshman CA, Armstrong R, Dawson L, Rowell AJ, Ruddle AR
5th IET Hybrid and Electric Vehicles Conference (HEVC 2014), London, UK. IET: 14737980; ISBN 978-1-84919-911-7
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2014,
Kim M, Kim S, Ahn S, Chun Y, Park S
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 426-429; ISBN 978-4-88552-287-1
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2014,
Gutierrez O, Navarro MA, de Adana FS, Escobar A, Moncada ME, Muñoz CM
J Electromagn Anal 6 (7): 141-155
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2014,
Seidman SJ, Bekdash O, Guag J, Mehryar M, Booth P, Frisch P
Biomed Eng Online 13: 110
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2013,
Seidman SJ, Guag JW
Biomed Eng Online 12: 71
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2012,
Bini M, Feroldi P, Ferri C, Ignesti A, Olmi R, Priori S, Riminesi C, Tobia L
G Ital Med Lav Ergon 34 (3) Suppl: 595-598
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2012,
Censi F, Mattei E, Triventi M, Bartolini P, Calcagnini G
Expert Rev Med Devices 9 (3): 283-288
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2012,
Mattei E, Censi F, Triventi M, Bartolini P, Calcagnini G
Expert Rev Med Devices 9 (3): 289-297
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2011,
Pantchenko OS, Seidman SJ, Guag JW, Witters Jr DM, Sponberg CL
Biomed Eng Online 10: 50
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Deutsche Kommission Elektrotechnik Elektronik Informationstechnik in DIN und VDE (DKE),
DIN EN 50364 VDE 0848-364:2010-11
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Association for the Advancement of Medical Instrumentation (AAMI),
AAMI TIR18:2010
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2010,
Carranza N, Ramos V, Lizana FG, Garcia J, del Pozo A, Monteagudo JL
Telemed J E Health 16 (7): 818-826
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2010,
Censi F, Calcagnini G, Mattei E, Triventi M, Bartolini P
2010 Annual International Conference of the IEEE Engineering in Medicine and Biology, Buenos Aires, Argentina. IEEE: 352-355; ISBN 978-1-4244-4123-5
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2010,
Seidman SJ, Kainz W, Casamento J, Witters D
Open Biomed Eng J 4: 63-70
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J Neurosci Nurs 40 (5): 299-303, 319
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2007,
Seidman SJ, Ruggera PS, Brockman RG, Lewis B, Shein MJ
Int J Radio Freq Ident Tech Appl 1 (3): 237-246
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2007,
Gruber S, Meier M, Moser M, Ryf S, Burgherr R, Fitzpatrick M, Riederer M, Siegenthaler A, Reusser D
Bundesamt für Gesundheit (BAG),
1-36
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2007,
Calcagnini G, Censi F, Bartolini P
Ann Ist Super Sanita 43 (3): 268-276
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Med Device Technol 16 (8): 26-7, 29
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2005,
Kainz W, Casamento JP, Ruggera PS, Chan DD, Witters DM
IEEE Trans Biomed Eng 52 (3): 520-530
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Med Device Technol 15 (8): 33-4, 36
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Arch Mal Coeur Vaiss 96: 57-64
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2001,
Geller L, Thuroczy G, Merkely B
Orv Hetil 142 (36): 1963-1970