Die folgenden Begriffe wurden einbezogen:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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2022,
Yang B, Chen CH, Graham SJ
IEEE Letters on Electromagnetic Compatibility Practice and Applications 4 (3): 83-87
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2022,
Liu S, Onishi T, Taki M, Watanabe S
IEEE Trans Electromagn Compat 64 (4): 963-974
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2022,
Gifuni A, Adil M, Grassini G, Buono A, Nunziata F, Micheli D, Migliaccio M
IEEE Trans Electromagn Compat 64 (4): 951-962
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IEEE Trans Electromagn Compat 64 (4): 941-950
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2022,
Xiao C, Hao S, Cheng D, Liao C
IEEE Trans Biomed Circuits Syst 16 (3): 372-383
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2022,
Gryz K, Karpowicz J, Zradziński P
Sensors 22 (5): 1719
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2022,
Shah IA, Basir A, Cho Y, Yoo H
IEEE Trans Electromagn Compat 64 (3): 640-649
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2022,
Budnarowska M, Mizeraczyk J, Bisewski D
Prz Elektrotechniczny 98 (2): 110-113
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2022,
Liu J, Wang Y, Guo R, Wang Q, Zheng J, Kurpad K, Kainz W, Chen J
IEEE Trans Electromagn Compat 64 (2): 286-294
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2022,
Lan J, Diao Y, Duan X, Hirata A
IEEE Trans Electromagn Compat 64 (2): 551-558
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2022,
Sassi O, Kadi M, Niederholz M
IEEE Trans Electromagn Compat 64 (1): 139-149
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2022,
Narusue Y, Morikawa H
IEEE Trans Magn 58 (2): 1-5
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Institute of Electrical and Electronics Engineers (IEEE),
IEEE Std 149-2021: 1-207, ISBN 978-1-5044-8017-8
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2021,
Yang C, Schierholz M, Trunczik E, Helmich LM, Brüns HD, Schuster C
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, Raleigh, NC, USA. IEEE: 697-702, ISBN 978-1-6654-4889-5
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Deutsche Kommission Elektrotechnik Elektronik Informationstechnik in DIN und VDE (DKE),
DIN EN IEC 61980-1:2021-09 VDE 0122-10-1:2021-09
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2021,
Das M, Vogt-Ardatjew R, Van den Berg B, Leferink F
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, Raleigh, NC, USA. IEEE: 857-861, ISBN 978-1-6654-4889-5
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2021,
Song X, Li R, Yue Y, Wan S
2021 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC). IEEE: 1-4, ISBN 978-1-7281-7622-2
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2021,
Adegbola R, Fifatin FX, Agbokpanzo R, Acakpovi A
2021 IEEE 8th International Conference on Adaptive Science and Technology (ICAST), Accra, Ghana. IEEE: 1-6, ISBN 978-1-6654-2718-0
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2021,
Evangelista J, Loschi H, Costa ET, Smolenski R, Moonen N, Vogt-Ardatjew R
2021 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC). IEEE: 1-4, ISBN 978-1-7281-7622-2
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2021,
Ardiatna W, Nugroho HW, Hidayat SW, Sukma I, Supono I, Mandaris D
2021 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC). IEEE: 1-4, ISBN 978-1-7281-7622-2
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2021,
Diao Y, Li K, Sasaki K, Kodera S, Laakso I, El Hajj W, Hirata A
IEEE Trans Electromagn Compat 63 (5): 1709-1716
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2021,
De Miguel-Bilbao S, Hernandez JA, Suarez OJ, Marina P, Febles VM, Rabassa LE, Suarez S, Karpowicz J, Zradzinski P, Gryz K, Aguirre E, Ramos V
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, Raleigh, NC, USA. IEEE: 13-18, ISBN 978-1-6654-4889-5
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2021,
Cruciani S, Campi T, Maradei F, Feliziani M
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, Raleigh, NC, USA. IEEE: 381-385, ISBN 978-1-6654-4889-5
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2021,
Svistunou A, Mordachev V, Sinkevich E, Ye M, Dubovik A
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, Raleigh, NC, USA. IEEE: 214-219, ISBN 978-1-6654-4889-5
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2021,
Sârbu A, Miclăuș S, Șorecău E, Bechet P
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, Raleigh, NC, USA. IEEE: 243-248, ISBN 978-1-6654-4889-5
