Die folgenden Begriffe wurden einbezogen:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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2018,
Kosterec M, Kurimský J, Vargová B
2018 19th International Scientific Conference on Electric Power Engineering (EPE), Brno, Czech Republic. IEEE: 1-6; ISBN 978-1-5386-4613-7
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2018,
Douglas MG, Pfeifer S, Kuehn S, Neufeld E, Pokovic K, Carrasco E, Samaras T, Christ A, Capstick M, Kuster N
2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore. IEEE: 92-94; ISBN 978-1-5090-3955-5
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2018,
Fukui S, Maeda N, Xiao F, Kami Y
2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore. IEEE: 331-335; ISBN 978-1-5090-3955-5
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2018,
Munhoz-Rojas PE, Segura-Salas CS, Costa AA, Martins R, Hoffmann-Neto J
2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore. IEEE: 1267-1273; ISBN 978-1-5090-3955-5
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2018,
Sun W, He Y, Diao Y, Leung SW, Siu YM, Kong YC
2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore. IEEE: 872-874; ISBN 978-1-5090-3955-5
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2018,
He Y, Sun W, Leung PSW, Siu TYM, Ng KT
2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore. IEEE: 936-939; ISBN 978-1-5090-3955-5
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2018,
Koh WJ, Moochhala SM
2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore. IEEE: 518-522; ISBN 978-1-5090-3955-5
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2018,
Vargová B, Majláth I, Kurimský J, Cimbala R, Kosterec M, Tryjanowski P, Jankowiak Ł, Raši T, Majláthová V
Exp Appl Acarol 75 (1): 85-95
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2018,
Zhang K, Du L, Zhu Z, Song B, Xu D
IEEE Trans Electromagn Compat 60 (4): 829 - 839
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2018,
Gomez-Tames J, Laakso I, Haba Y, Hirata A, Poljak D, Yamazaki K
IEEE Trans Electromagn Compat 60 (3): 589 - 597
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2018,
Poljak D, Cvetković M, Bottauscio O, Hirata A, Laakso I, Neufeld E, Reboux S, Warren C, Giannopolous A, Costen F
IEEE Trans Electromagn Compat 60 (2): 328 - 337
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2019,
Ruddle AR, Martin AJM
IEEE Electromagn Compat Mag 8 (3): 75-85
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2019,
Le DT, Li K, Watanabe S, Onishi T
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: 78-81; ISBN 978-1-7281-1639-6
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2019,
Hussien HI, Ayob MA, Warsito IF, Supriyanto E, Reihannisha I
2019 International Conference on Technologies and Policies in Electric Power & Energy, Yogyakarta, Indonesia. IEEE: 1-4; ISBN 978-1-7281-5693-4
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2019,
Bieth F, Delmote P, Schneider M
IEEE Trans Plasma Sci 47 (6): 2987-2994
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2019,
Liu J, Zheng J, Zeng Q, Wang Q, Rondoni J, Olsen J, Kainz W, Chen J
IEEE Trans Electromagn Compat 61 (4): 1091-1097
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2019,
Virjoghe EO, Bancuta I, Husu AG, Cazacu D, Florescu V
J Sci Arts No.1 (46): 249-259
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2019,
Zeng Q, Liu J, Angelone LM, Lloyd T, Wedan S, Chen J, Kainz W
IEEE Trans Electromagn Compat 61 (5): 1423-1431
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2019,
Botsa VR, Kumar Munaka S, Dushyanth M, Bandaru S
2019 IEEE 5th Global Electromagnetic Compatibility Conference (GEMCCON), Bangalore, India. IEEE: 1-4; ISBN 978-1-7281-4153-4
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2019,
Katkoria V, Ghosh P, Chaudhury B
2019 IEEE MTT-S International Microwave and RF Conference (IMARC), Mumbai, India. IEEE: 1-5; ISBN 978-1-7281-4041-4
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2019 IEEE 3rd International Electrical and Energy Conference (CIEEC), Beijing, China. IEEE: 1507-1512; ISBN 978-1-7281-1676-1
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2019,
Cruciani S, Campi T, Maradei F, Feliziani M
2019 IEEE PELS Workshop on Emerging Technologies: Wireless Power Transfer (WoW), London, United Kingdom. IEEE: 173-176; ISBN 978-1-7281-0881-0
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2019,
Geyikoglu MD, Koc Polat H, Cavusoglu B
2019 Fifth International Electromagnetic Compatibility Conference (EMC Turkiye), Kocaeli, Turkey. IEEE: 1-5; ISBN 978-1-7281-1836-9
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2019,
Ren X, Liu W, Su Z, Wu H, Qiao S, Lu H, Shen G
2019 12th International Congress on Image and Signal Processing, BioMedical Engineering and Informatics (CISP-BMEI), Suzhou, China. IEEE: 1-5; ISBN 978-1-7281-4853-3
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2019,
Shoaib N, Zaidi SNF, Shafqat A, Cheema HM
2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo), Hangzhou, China. IEEE: 210-212; ISBN 978-1-7281-4263-0
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2019,
Songcen W, Bin W, Xiaokang W, Chong X, Jinxing X, Weimei G, Jiaqi X
2019 22nd International Conference on Electrical Machines and Systems (ICEMS), Harbin, China. IEEE: 1-7; ISBN 978-1-7281-3399-7
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2019,
Viorica V, Mircea-Emilian A, Paul N, Florel R
2019 International Conference on Electromechanical and Energy Systems (SIELMEN), Craiova, Romania. IEEE: 1-5; ISBN 978-1-7281-4012-4
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2019,
Škiljo M, Blažević Z, Poljak D
2019 International Conference on Software, Telecommunications and Computer Networks (SoftCOM), Split, Croatia. IEEE: 1-5; ISBN 978-1-7281-3711-7
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2019,
Kozlov M, Angelone LM, Rajan S
IEEE Trans Electromagn Compat: 2311-2316
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2019,
Sekiba Y, Yamazaki K
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: 83-86; ISBN 978-1-7281-1639-6
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2019,
Gomez-Tames J, Rashed E, Hirata A, Tarnaud T, Tanghe E, Van de Steene T, Martens L, Joseph W
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: 162-165; ISBN 978-1-7281-1639-6
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2019,
Sasaki K, Li K, Wake K, Watanabe S, Higashiyama J, Onishi T
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: 43-46; ISBN 978-1-7281-1639-6
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2019,
Miwa K, Takenaka T, Hirata A
IEEE Trans Electromagn Compat 61 (6): 2024-2030
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2019,
Shiina T, Yamazaki K
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: 744-747; ISBN 978-1-7281-1639-6
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2019,
Kageyama I, Masuda H, Morimatsu Y, Ishitake T, Sakakibara K, Hikage T, Hirata A
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: 766-769; ISBN 978-1-7281-1639-6
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2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: 166-169; ISBN 978-1-7281-1639-6
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2019,
He Y, Leung PSW, Chow Y, Diao Y
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: 750-753; ISBN 978-1-7281-1639-6
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2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: 691-694; ISBN 978-1-7281-1639-6
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2019,
Feng Z, Diao Y, Sun W, He Y, Leung PSW
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: 48-51; ISBN 978-1-7281-1639-6
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2019,
Laakso I, Lehtinen T
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: 334-337; ISBN 978-1-7281-1639-6
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2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Barcelona, Spain. IEEE: 82-87; ISBN 978-1-7281-0595-6
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2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Barcelona, Spain. IEEE: 1020-1024; ISBN 978-1-7281-0595-6
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2019,
Gryz K, Karpowicz J
2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Barcelona, Spain. IEEE: 1030-1033; ISBN 978-1-7281-0595-6
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2019,
Alilou O, Grange F, Abdelli N, Journet S, Ribeiro J, Kouassi A, Maniscalco C, Machet A
2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Barcelona, Spain. IEEE: 1034-1038; ISBN 978-1-7281-0595-6
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2019,
Bechet AC, Helbet R, Miclaus S, Bouleanu I, Sarbu A, Bechet P
2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Barcelona, Spain. IEEE: 1025-1029; ISBN 978-1-7281-0595-6
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2019,
Campi T, Cruciani S, Maradei F, Feliziani M
2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Barcelona, Spain. IEEE: 1116-1121; ISBN 978-1-7281-0595-6
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2019,
De Miguel-Bilbao S, Blas J, Karpowicz J, Ramos V
2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Barcelona, Spain. IEEE: 1112-1115; ISBN 978-1-7281-0595-6
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2019,
Willmann B, Rabe H, Leugers C, Sassi O, Waldera C, Vick R
2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Barcelona, Spain. IEEE: 513-517; ISBN 978-1-7281-0595-6
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2019,
Gomez-Tames J, Tarnaud T, Miwa K, Hirata A, Van de Steene T, Martens L, Tanghe E, Joseph W
IEEE Trans Electromagn Compat 61 (6): 1944 - 1952
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Strahlenschutzkommission (SSK),
1-45