Die folgenden Begriffe wurden einbezogen:
Dezibel, dB, decibel, デシベル
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2022,
Sanchez Aquino JM, Arroyo Pizarro A, Amaya Fariño LM, Jaramillo Chamba DA, Jaramillo Infante MK
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2019,
Sang M, Wang S, Liu S, Liu M, Bai L, Jiang W, Xuan S, Gong X
ACS Appl Mater Interfaces 11 (50): 47340-47349
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2015,
Sangun O, Dundar B, Darici H, Comlekci S, Doguc DK, Celik S
Electromagn Biol Med 34 (1): 63-71
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2023,
Sankar Ponnapalli VA, Reddy GS, Rohith Goud PS, Saharsh P, Praveena A
2023 International Conference on Computer Communication and Informatics (ICCCI), Coimbatore, India. IEEE: 1-5; ISBN 9798350348224
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2016,
Santos-Pontelli TE, Rimoli BP, Favoretto DB, Mazin SC, Truong DQ, Leite JP, Pontes-Neto OM, Babyar SR, Reding M, Bikson M, Edwards DJ
PLoS One 11 (3): e0152331
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2024,
Särestöniemi M, Singh D, Dessai R, Heredia C, Myllymäki S, Myllylä T
Sensors 24 (6): 1975
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2013,
Saritas EU, Goodwill PW, Zhang GZ, Conolly SM
IEEE Trans Med Imaging 32 (9): 1600-1610
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2012,
Saritas EU, Goodwill PW, Zhang GZ, Yu W, Conolly SM
Magnetic Particle Imaging. A Novel SPIO Nanoparticle Imaging Technique. Springer: 325-330; ISBN 978-3-642-24133-8
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2020,
Sarkar P, Hasan RR, Sinha S, Rahman MA, Niloy TSR
2020 IEEE Region 10 Symposium (TENSYMP), Dhaka, Bangladesh. IEEE: 1498-1501; ISBN 978-1-7281-7367-2
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2019,
Sasaki K, Li K, Wake K, Watanabe S, Higashiyama J, Onishi T
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: 43-46; ISBN 978-1-7281-1639-6