キーワード:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
-
2013,
Hikage T, Kawamura Y, Nojima T, Nagaoka T, Watanabe S
International Symposium on Electromagnetic Compatibility, Brugge, 2013. IEEE: 165-168; ISBN 978-1-4673-4980-2
-
J Microw Power 18 (2): 181-195
-
2009,
Hille S, Eichhorn KF, Gonschorek KH
2009 IEEE International Symposium on Electromagnetic Compatibility, Austin, TX, USA. IEEE: 147-152; ISBN 978-1-4244-4266-9
-
2008,
Hille S, Eichhorn KF, Gonschorek KH
International Symposium on Electromagnetic Compatibility - EMC Europe, Hamburg, 2008. IEEE: 1-5; ISBN 978-1-4244-4097-9
-
2021,
Hirata A, Diao Y, Onishi T, Sasaki K, Ahn S, Colombi D, De Santis V, Laakso I, Giaccone L, Joseph W, Rashed EA, Kainz W, Chen J
IEEE Trans Electromagn Compat 63 (5): 1619-1630
-
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: 1-5; ISBN 978-1-7281-5580-7
-
2013,
Hirata A, Tsuchida S, Laaskso I
International Symposium on Electromagnetic Compatibility, Brugge, 2013. IEEE: 89-92; ISBN 978-1-4673-4980-2
-
2010,
Hirata A, Fujiwara O, Nagaoka T, Watanabe S
IEEE Trans Electromagn Compat 52 (1): 41-48
-
2007,
Hirata A, Nagaya Y, Fujiwara O, Nagaoka T, Watanabe S
2007 IEEE International Symposium on Electromagnetic Compatibility, Honolulu, HI, USA. IEEE: 1-4; ISBN 978-1-4244-1349-2
-
2006,
Hirata A, Fujimoto M, Asano T, Jianqing Wang, Fujiwara O, Shiozawa T
IEEE Trans Electromagn Compat 48 (3): 569-578
-
IEEE Trans Electromagn Compat 47 (1): 68-76
-
2003,
Hirata A, Morita M, Shiozawa T
IEEE Trans Electromagn Compat 45 (1): 109-116
-
2002,
Hirata A, Watanabe H, Shiozawa T
IEEE Trans Electromagn Compat 44 (4): 592-594
-
2000,
Hirata A, Matsuyama SI, Shiozawa T
IEEE Trans Electromagn Compat 42 (4): 386-393
-
2020,
Hong S, Jeong S, Lee S, Sim B, Kim H, Kim J
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: 623-625; ISBN 978-1-7281-7431-0
-
IEEE Electromagn Compat Mag 9 (3): 96-99
-
IEEE Electromagn Compat Mag 2 (4): 71
-
1987 IEEE International Symposium on Electromagnetic Compatibility, Atlanta, GA, USA. IEEE: 501-504; ISBN 978-1-5090-3174-0
-
2016,
Hou J, Xu T, Wang X, Yi P
Zhongguo Yi Liao Qi Xie Za Zhi 40 (4): 282-285
-
2018,
Houran MA, Yang X, Chen W, Samizadeh M
2018 International Power Electronics Conference (IPEC-Niigata 2018 -ECCE Asia), Niigata, Japan. IEEE: 1062-1066; ISBN 978-1-5386-4190-3
-
IEEE Electromagn Compat Mag 7 (1): 78-86
-
2019,
Hussien HI, Ayob MA, Warsito IF, Supriyanto E, Reihannisha I
2019 International Conference on Technologies and Policies in Electric Power & Energy, Yogyakarta, Indonesia. IEEE: 1-4; ISBN 978-1-7281-5693-4
-
2017,
Hwang JH, Kang TW, Kwon JH, Park SO
IEEE Trans Electromagn Compat 59 (1): 48-57
-
2023,
Hwata C, Rushingabigwi G, Gatera O, Twizere C, Mukanyiligira D, Thomas BN
2023 Photonics & Electromagnetics Research Symposium (PIERS), Prague, Czech Republic. IEEE: 1389-1396; ISBN 9798350312850
-
2017,
Il Kwak S, Sim DU, Kwon JH, Yoon YJ
IEEE Trans Electromagn Compat 59 (1): 297-300