キーワード:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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2021,
De Miguel-Bilbao S, Hernandez JA, Suarez OJ, Marina P, Febles VM, Rabassa LE, Suarez S, Karpowicz J, Zradzinski P, Gryz K, Aguirre E, Ramos V
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, Raleigh, NC, USA. IEEE: 13-18; ISBN 978-1-6654-4889-5
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2019,
De Miguel-Bilbao S, Blas J, Karpowicz J, Ramos V
2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Barcelona, Spain. IEEE: 1112-1115; ISBN 978-1-7281-0595-6
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2018,
De Miguel-Bilbao S, Blas J, Falcone F, Ramos V
2018 International Symposium on Electromagnetic Compatibility (EMC EUROPE), Amsterdam, Netherlands. IEEE: 510-514; ISBN 978-1-4673-9699-8
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2017,
De Miguel-Bilbao S, Blas J, Aguirre E, Iturri PL, Azpilicueta L, Falcone F, Ramos V
2017 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Angers. IEEE, Angers, France; ISBN 978-1-5386-0689-6
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2011,
De Santis V, Beeckman PA, Lampasi DA, Feliziani M
IEEE Trans Biomed Eng 58 (2): 390-396
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Arch Mal Coeur Vaiss 96 (Spec. III): 65-70
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2016,
Degirmenci E, Thors B, Törnevik C
IEEE Trans Electromagn Compat 58 (4): 1110-1117
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1974,
del Blanco JB, Romero-Sierra C, Tanner JA
1974 IEEE Electromagnetic Compatibility Symposium Record, San Francisco, CA, USA. IEEE: 1-7; ISBN 978-1-5090-3160-3
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1973,
del Blanco JB, Romero-Sierra C, Tanner JA
1973 IEEE International Electromagnetic Compatibility Symposium Record, New York, NY, USA. IEEE: 1-6; ISBN 978-1-5090-3159-7
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2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore. IEEE: 959-962; ISBN 978-1-5090-3955-5
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2020,
Dergham I, Martinez Rocha JC, Imad R, Alayli Y
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: 1-5; ISBN 978-1-7281-5580-7
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2020,
Di Francesco A, De Santis V
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: 1-5; ISBN 978-1-7281-5580-7
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IEEE Trans Electromagn Compat 65 (5): 1282-1291
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2022,
Diao Y, Rashed EA, Hirata A
IEEE Trans Electromagn Compat 64 (6): 1969-1977
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2021,
Diao Y, Li K, Sasaki K, Kodera S, Laakso I, El Hajj W, Hirata A
IEEE Trans Electromagn Compat 63 (5): 1709-1716
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IEEE Trans Electromagn Compat 63 (5): 1690-1698
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2016,
Diao YL, Sun WN, Leung SW, Siu YM, Chan KH
2016 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Shenzhen, China. IEEE: 329-331; ISBN 978-1-4673-9494-9
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2014,
Diao YL, Sun WN, Chan KH, Leung SW, Siu YM
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 226-229; ISBN 978-4-88552-287-1
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2020,
Dinarević EC, Poljak D, Blažević Z
2020 International Conference on Software, Telecommunications and Computer Networks (SoftCOM), Split, Hvar, Croatia. IEEE: 1-4; ISBN 978-1-7281-7538-6
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2014,
Döbbelin R, Förster S, Lindemann A
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 369-374; ISBN 978-1-4799-3226-9
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2018,
Douglas MG, Pfeifer S, Kuehn S, Neufeld E, Pokovic K, Carrasco E, Samaras T, Christ A, Capstick M, Kuster N
2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore. IEEE: 92-94; ISBN 978-1-5090-3955-5
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2018,
Drandić A, Trkulja B
Engineering Analysis with Boundary Elements 91: 1-6
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2022,
Duris V, Ivanov VN, Chumarov SG
TEM J 11 (2): 920-925
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2017,
Dürrenberger G, Leuchtmann P, Röösli M, Siegrist M, Sütterlin B
Swiss Federal Office of Energy (SFOE),
Statusbericht 2017: 1-125
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2016,
Dürrenberger G, Leuchtmann P, Röösli M, Siegrist M, Sütterlin B
Swiss Federal Office of Energy (SFOE),
Statusbericht 2016: 1-113
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J Neurosci Nurs 40 (5): 299-303, 319
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J Egypt Soc Parasitol 38 (3): 945-956
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2022,
ElShami IF, Elwrfalli K, Elgayar AI, Elgaud MM, Yousuf FH, Elmangosh N
2022 International Conference on Engineering & MIS (ICEMIS), Istanbul, Turkey. IEEE: 1-5; ISBN 978-1-6654-5437-7
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2016,
Emmer W, Schmautzer E, Tiran K
2016 51st International Universities Power Engineering Conference (UPEC), Coimbra. IEEE; ISBN 978-1-5090-4651-5
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2016,
Endo Y, Saito K, Watanabe S, Takahashi M, Ito K
IEEE Trans Electromagn Compat 58 (1): 30-39
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2022,
Esmaeili H, Yang C, Schuster C
2022 International Symposium on Electromagnetic Compatibility – EMC Europe, Gothenburg, Sweden. IEEE: 467-472; ISBN 978-1-6654-0789-2
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2021,
Evangelista J, Loschi H, Costa ET, Smolenski R, Moonen N, Vogt-Ardatjew R
2021 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Nusa Dua - Bali, Indonesia. IEEE: 1-4; ISBN 978-1-7281-7622-2
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2016,
Fall AK, Besnier P, Lemoine C, Zhadobov M, Sauleau R
IEEE Trans Electromagn Compat 58 (4): 981-992
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2018,
Feliziani M, Campi T, Cruciani S, De Santis V
2018 International Symposium on Electromagnetic Compatibility (EMC EUROPE), Amsterdam, Netherlands. IEEE: 155-160; ISBN 978-1-4673-9699-8
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2019,
Feng Z, Diao Y, Sun W, He Y, Leung PSW
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: 48-51; ISBN 978-1-7281-1639-6
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2006,
Fernandez-Chimeno M, Quilez M, Silva F
IEEE Trans Biomed Eng 53 (6): 1206-1209
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2020,
Fiedler TM, Ladd ME, Clemens M, Bitz AK
IEEE Letters on Electromagnetic Compatibility Practice and Applications 2 (3): 85-91
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IEEE Trans Electromagn Compat 35 (1): 36-45
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1979 IEEE International Symposium on Electromagnetic Compatibility, San Diego, CA, USA. IEEE: 385-391; ISBN 978-1-5090-3165-8
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2016,
Frezzi P, Hug R, Grant J, Klingler A
2016 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Wroclaw, Poland. IEEE: 876-881; ISBN 978-1-5090-1417-0
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2015,
Frikha A, Bensetti M, Pichon L, Lafon F, Duval F, Benjelloun N
IEEE Trans Electromagn Compat 57 (6): 1481-1490
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2006,
Fujimoto M, Hirata A, Wang J, Fujiwara O, Shiozawa T
IEEE Trans Electromagn Compat 48 (1): 240-247
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2018,
Fukui S, Maeda N, Xiao F, Kami Y
2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore. IEEE: 331-335; ISBN 978-1-5090-3955-5
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2002,
Fung LC, Leung SW, Chan KH
2002 IEEE International Symposium on Electromagnetic Compatibility, Minneapolis, MN, USA. 2巻; IEEE: 656-661; ISBN 978-0-7803-7264-1
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2017,
Gabriadze G, Chiqovani G, Yavolovskaya E, Svanidze L, Karkashadze D, Jobava R
2017 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Angers. IEEE, Angers, France; ISBN 978-1-5386-0689-6
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IEEE Trans Electromagn Compat 37 (4): 547-558
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2020,
Gao Z, Zhang W, Chen X
Zhongguo Yi Liao Qi Xie Za Zhi 44 (4): 302-306
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2010,
Gati A, Conil E, Wong MF, Wiart J
IEEE Trans Electromagn Compat 52 (4): 829 - 836
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2001,
Geller L, Thuroczy G, Merkely B
Orv Hetil 142 (36): 1963-1970
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2017,
Gercek C, Magne I, Kourtiche D, Schmitt P, Roth P, Nadi M, Souques M
2017 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Angers. IEEE, Angers, France: 1-5; ISBN 978-1-5386-0689-6