キーワード:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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2014,
Arima T, Uno T, Wake K, Fujii K, Watanabe S
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 529-532; ISBN 978-4-88552-287-1
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2014,
Shimizu HO, Shimizu K
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 162-165; ISBN 978-4-88552-287-1
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2014,
Higashiyama J, Tarusawa Y
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 650-653; ISBN 978-4-88552-287-1
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2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 625-628; ISBN 978-4-88552-287-1
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2014,
Miyaji Y, Shimada M, Mizuno Y, Naito K
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 621-624; ISBN 978-4-88552-287-1
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2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 206-209; ISBN 978-4-88552-287-1
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2014,
Bieth F, Schunck T, Pinguet S, Delmote P
IEEE Trans Electromagn Compat 56 (4): 964-969
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2014,
Seidman S, LaSorte N
IEEE Electromagn Compat Mag 3 (3): 49-54
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2014,
Chen XL, Umenei AE, Baarman DW, Chavannes N, De Santis V, Mosig JR, Kuster N
IEEE Trans Electromagn Compat 56 (5): 1027-1034
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2014,
Seidman SJ, Pantchenko O, Tennakoon D
IEEE Electromagn Compat Mag 3 (1): 70-74